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5 дней назад

Foundry Customer Integration Engineer (Semiconductor)

87 700 - 137 000
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Ireland
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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TL;DR

Foundry Customer Integration Engineer (Semiconductor): Managing customer-specific process integration issues and driving yield improvements for advanced node semiconductor manufacturing with an accent on FEOL/BEOL process integration and cross-functional collaboration. Focus on systemizing technical learnings, automating workflows, and ensuring high-volume manufacturing performance targets are met.

Location: Must be based in or able to work on-site in Leixlip, Ireland (Hybrid model).

Salary: €87,700 – €137,000 per year.

Company

A global leader in semiconductor manufacturing, driving innovation in silicon process and packaging technology for the AI era.

What you will do

  • Serve as the single point of contact for customer FEOL/BEOL process integration issues.
  • Identify recurring patterns in customer engagements and systemize best practices across technologies.
  • Collaborate with Technology Development teams to import new technologies into customer products.
  • Analyze root causes of yield and performance issues to implement effective mitigation plans.
  • Own engineering projects aimed at improving product quality and reducing wafer costs.
  • Communicate complex technical information between the customer and the factory floor.

Requirements

  • Bachelor's degree in science or engineering.
  • 15+ years of experience in advanced node semiconductor FEOL process integration.
  • 15+ years of experience in advanced node development or high-volume manufacturing.
  • Strong problem-solving skills with a high degree of autonomy.
  • Ability to work effectively in multi-functional and multi-cultural teams.
  • Excellent communication skills with the ability to distill complex technical data.

Nice to have

  • Master's or Ph.D. in Electrical Engineering, Physics, or Materials Science.
  • Experience in project or program management.
  • Solid understanding of module processes including lithography, dry/wet etch, CMP, thin films, and metrology.
  • Demonstrated ability to influence and motivate cross-functional teams.

Culture & Benefits

  • Competitive total compensation package.
  • Hybrid work model allowing for on-site and off-site flexibility.
  • Opportunity to work within a worldwide factory network on cutting-edge AI-era technology.
  • Commitment to an inclusive workplace with equal opportunity employment practices.

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