Package Application Engineer (Manufacturing)

TL;DR

Package Application Engineer (Manufacturing): Designing and optimizing product packing methods to meet functional requirements and manufacturing excellence with an accent on EIA/IEC standards and material design control. Focus on identifying technical risks, performing fitting simulations, and ensuring effective implementation of packing materials throughout the development lifecycle.

Location: Seremban, Malaysia (Onsite)

Company

hirify.global is a global semiconductor manufacturer specializing in discrete, logic, and MOSFET devices.

What you will do

• Develop optimal packing methods including carrier tape, labels, and inner boxes in compliance with design requirements and industry standards.
• Identify technical risks and propose mitigations using tools like Design FMEA and fitting simulation analysis.
• Manage material design change control for all packing components.
• Ensure effective implementation of packing materials throughout the product development lifecycle.
• Collaborate with supplier quality and procurement teams to assess technology capabilities.
• Provide expert support to engineering teams for continuous improvement and customer change requests.

Requirements

• Degree in Engineering, Materials Science, or a related field.
• Knowledge of IC/discrete package design.
• Experience with design tools such as simulation, Design FMEA, and CAD.
• Good command of written and spoken English.
• Ability to work with minimal supervision and strong problem-solving skills.
• Willingness to travel occasionally.

Nice to have

• Master’s degree or higher.
• Experience in solder footprint design.
• Experience in handling customers.
• Proficiency in Putonghua.

Culture & Benefits

• Commitment to diversity and inclusion with active employee resource groups.
• Focus on professional development and engineering excellence.
• Supportive work environment with reasonable adjustments provided.
• Goal-oriented culture aiming for increased representation in management.