Process Development Engineer (Wire Bond)

TL;DR

Process Development Engineer (Wire Bond): Developing and optimizing semiconductor assembly processes to meet functional requirements with an accent on wire bond technology and FOL process stability. Focus on driving end-to-end process development from concept to high-yield manufacturing using structured engineering methods like DOE, SPC, and Six Sigma.

Location: Onsite in Seremban, Malaysia

Company

hirify.global is a global semiconductor manufacturer specializing in essential power and logic components.

What you will do

• Develop and characterize new semiconductor process technologies using structured engineering methods.
• Drive end-to-end process development from initial concept to stable, high-yield manufacturing.
• Lead technical troubleshooting and problem-solving for wire bond and FOL processes.
• Apply statistical analysis tools to optimize process performance and drive data-based decisions.
• Provide technical support for wire bond-related issues for internal and external customers.
• Collaborate across project teams and sites to ensure technical alignment and manufacturing excellence.

Requirements

• Bachelor’s degree in engineering or a related field.
• Minimum 5 years of experience in a semiconductor or manufacturing environment.
• Hands-on experience in FOL processes including wafer dicing, die bond, plasma, and wire bond.
• Strong knowledge of wire bond packaging technologies.
• Proficiency in Six Sigma methodologies and statistical tools like Minitab or Statistica.
• Fluent English communication skills.

Culture & Benefits

• Commitment to diversity and inclusion with active employee resource groups.
• Focus on professional growth and technical leadership.
• Supportive work environment with a dedication to equal opportunity.
• Global company culture with cross-site collaboration opportunities.