Process Integration Device Engineer (Semiconductors)

TL;DR

Process Integration Device Engineer (Semiconductors): Leading the development and transfer of HV/BCD semiconductor technologies with an accent on process integration and device physics. Focus on optimizing device architecture (LDMOS, EDMOS, ESD) and managing technical interfaces with external foundries.

Location: Shanghai (JingAn), China

Company

Global leader in secure connectivity solutions for embedded applications across automotive, industrial, IoT, and mobile markets.

What you will do

• Lead the development, integration, and transfer of HV/BCD semiconductor technologies.
• Serve as the primary technical interface between NXP and external foundries in China.
• Optimize HV/BCD device architectures, specifically LDMOS, EDMOS, and ESD.
• Conduct root-cause analysis and accelerate development using 2D/3D TCAD simulations.
• Analyze process integration deviations to improve performance, yield, and reliability.
• Collaborate with internal Business, Design, and PE teams to align with product roadmaps.

Requirements

• Master’s or Ph.D. in Electrical Engineering, Solid-State Physics, or Materials Science.
• 10+ years of semiconductor industry experience in process integration or device engineering.
• Profound knowledge of HV and BCD technologies and experience in technology transfer.
• Hands-on experience with TCAD tools (Sentaurus / Silvaco).
• Fluent English and Mandarin proficiency required.
• Must be based in Shanghai, China.

Nice to have

• Familiarity with JMP and Cadence.

Culture & Benefits

• Comprehensive online and offline learning opportunities for professional growth.
• Inclusive work environment with a strong commitment to diversity and equality.
• Corporate focus on sustainability and measurable year-on-year progress.