SoC Chiplet Design Lead (AI)

TL;DR

SoC Chiplet Design Lead (AI): Driving the design and development of advanced SoC architectures for AI, HPC, and automotive markets with an accent on performance, scalability, and efficiency. Focus on leading the entire silicon lifecycle from concept and RTL through verification and tape-out.

Location: Hybrid (Toronto, Ottawa, Boston, Austin, or Santa Clara) with potential for remote work within North America

Company

hirify.global is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency.

What you will do

• Lead cross-functional teams through the entire SoC lifecycle, from concept and architecture to RTL, verification, and tape-out.
• Drive the development of advanced SoC architectures targeting AI, HPC, and automotive markets.
• Collaborate with system, verification, physical design, and packaging teams to deliver complex silicon.
• Balance critical tradeoffs between performance, power, cost, and features.
• Manage internal and third-party IP integrations and lead comprehensive design reviews.
• Mentor and develop high-performing engineering teams.

Requirements

• Deep background in SoC and chiplet design, with expertise in RTL design (Verilog/SystemVerilog) and digital architecture.
• Proven experience leading end-to-end SoC development from concept to volume production.
• Mastery of SoC verification, synthesis, and timing closure workflows.
• Must be eligible to access U.S. export-controlled technology (contingent upon citizenship, permanent residency, or license approval).
• Must be based in or able to work within North America.

Nice to have

• Experience building SoC chiplet architectures at advanced process nodes (e.g., 7nm, 5nm).
• Experience with low-power and high-speed design including RISC-V, UCIe, and coherent fabrics.

Culture & Benefits

• Collaborative environment that values curiosity and a commitment to solving hard problems.
• Opportunity to work with a diverse team of technologists building the best AI platform possible.
• Exposure to next-generation AI hardware and cutting-edge semiconductor innovations.
• Flexible work arrangements including hybrid and case-by-case remote options within North America.