Principal Process Development Engineer (Semiconductors)

TL;DR

Principal Process Development Engineer (Semiconductors): Developing and characterizing new die attach process technologies for semiconductor packaging with an accent on robust manufacturability and process stability. Focus on optimizing wafer metallization, leading cross-site technical problem solving, and ensuring package reliability.

Location: Seremban, Malaysia (Onsite)

Company

hirify.global is a global semiconductor manufacturer dedicated to innovation in packaging and process development with a strong commitment to diversity and inclusion.

What you will do

• Develop and characterize new die attach process technologies to support next-generation semiconductor packaging.
• Lead technical discussions on die attach (DA) topics within project teams to ensure effective communication.
• Optimize wafer metallization processes and provide technical input for assembly equipment solutions.
• Create robust manufacturing solutions to ensure long-term package reliability and process stability.
• Conduct competitor benchmarking and technology studies to support the package roadmap development.
• Drive cross-site technical problem solving and process improvement initiatives across global teams.

Requirements

• Bachelor’s degree in engineering or a related discipline.
• Minimum 5 years of experience in a semiconductor manufacturing environment.
• Hands-on experience in die attach processes, specifically eutectic, epoxy, and DAF.
• Strong knowledge of FOL processes, including die bond, wire bond, and AOI.
• Experience applying Six Sigma methodologies and statistical tools such as DOE, SPC, FMEA, 8D, and Minitab/Statistica.
• Fluent English is required for collaboration with global teams and internal/external customers.

Culture & Benefits

• Equal-opportunity employer valuing diversity to drive better team performance.
• Inclusive and accessible recruitment process with reasonable adjustments available upon request.
• Access to employee resource groups, including the Pride Network and global Women's groups.
• Strong corporate commitment to increasing women in management positions to 30% by 2030.