Forward Deployed Engineer (AI)

TL;DR

Forward Deployed Engineer (AI): Building and scaling internal AI infrastructure and products to bridge the gap between AI R&D and business unit deployment with an accent on reusable agent scaffolding and on-prem inference. Focus on designing persistent memory systems, optimizing model serving, and establishing CI/CD pipelines for AI agents.

Location: Must be based in Ann Arbor, MI, USA

Salary: $111,900 - $190,200 Annually

Company

A global leader in diversified electronics for the semiconductor manufacturing ecosystem, investing 15% of sales back into R&D.

What you will do

• Build and enhance AI products and tools for the business, owning end-to-end product quality and reliability.
• Deploy AI capabilities into business units, acting as the bridge between R&D and production.
• Architect and maintain internal AI infrastructure, including agent scaffolding and evaluation frameworks.
• Design persistent context and memory systems to create personalized and evolving AI environments.
• Operate on-prem inference infrastructure for deployments where data cannot leave the network.
• Set technical standards and mentor junior engineers through design reviews and development golden paths.

Requirements

• Location: Must be based in Ann Arbor, MI, USA
• Education: Doctorate with 0 years exp, Master's with 3 years exp, or Bachelor's with 5 years exp.
• 3+ years of experience building and operating production-grade ML/AI systems.
• Strong proficiency in Python and experience with ML frameworks and model fine-tuning.
• Hands-on experience with inference optimization, model serving, and on-prem deployment patterns.
• Working knowledge of CI/CD, containerization, orchestration, and Infrastructure-as-Code.

Nice to have

• Prior experience in semiconductor, manufacturing, or scientific/industrial ML.
• Experience designing plugin architectures or extensible platform components.

Culture & Benefits

• Comprehensive rewards package including medical, dental, and vision insurance.
• 401(K) with company matching and employee stock purchase program (ESPP).
• Financial support via student debt assistance and tuition reimbursement.
• Paid time off, company holidays, and family care and bonding leave.
• High-innovation environment with a focus on tackling complex technical problems.