Staff/Principal Package R&D Engineer (Semiconductor)

TL;DR

Staff/Principal Package R&D Engineer (Semiconductor): Developing and optimizing semiconductor packaging architectures to ensure product functionality and performance with an accent on architectural thinking and technical leadership. Focus on leading technical projects, supporting OSATs, and implementing innovative packaging solutions.

Location: Onsite in Seremban

Company

hirify.global is a world-class company specializing in semiconductor development and in-house production.

What you will do

• Act as Package Architect with primary responsibility for the functionality and performance of semiconductor products.
• Lead small technical projects and provide first-level technical support onsite.
• Support OSATs technically and interface with the global package and assembly development community.
• Collect technical customer needs and market trends to propose innovative architectural solutions.
• Collaborate within an engaged multi-cultural team with internal and external development and production partners.

Requirements

• Master’s degree or PhD in Semiconductor Packaging, Chemistry, Physics, Materials Technology, Mechanical Engineering, or similar.
• Strong leadership skills, proactive mindset, and architectural thinking.
• Ability to perform structured problem solving and critical judgement in a fast-paced environment.
• Fluent Business English proficiency is required.
• Must be based in or able to work onsite in Seremban.

Nice to have

• Proficiency in Mandarin.
• Experience in thermomechanical simulation.

Culture & Benefits

• Permanent employment contract with attractive remuneration and social benefits.
• Wide range of further training and professional development opportunities.
• Inclusive and diverse work environment with active employee resource groups (Pride Network, Women's groups).
• Global network of talent with a culture of passion, performance, and professionalism.