Technician IV - Engineering (Semiconductor)

TL;DR

Technician IV - Engineering (Semiconductor): Supporting semiconductor device assembly, process development, and new product introduction with an accent on die attach and wire bonding processes. Focus on optimizing manufacturing operations, troubleshooting equipment issues, and ensuring strict compliance with military and industry standards.

Location: Onsite in Lowell, MA, USA

Company

hirify.global is a leading provider of smart, connected, and secure embedded control solutions for the semiconductor industry.

What you will do

• Set up, operate, and maintain equipment used in die attach and wire bonding processes.
• Perform hands-on troubleshooting of process and equipment issues and assist in root cause investigations.
• Collect and analyze production data to support yield improvement and process stability.
• Develop and maintain work instructions, process documentation, and training materials.
• Train and mentor junior technicians and operators on equipment and best practices.
• Ensure all operations adhere to MIL-PRF-19500, MIL-PRF-38534, and IPC-600 standards.

Requirements

• 5–7 years of experience in a semiconductor or electronics manufacturing environment.
• Strong hands-on experience with die attach and wire bonding equipment.
• Ability to read and interpret technical drawings and detailed process flows.
• Proficiency with Microsoft Excel for data tracking and reporting.
• Experience working in a cleanroom or controlled manufacturing environment.
• Must be based in or able to work onsite in Lowell, MA.

Nice to have

• Experience with chip-and-wire assembly and MMIC device handling.
• Hands-on experience with materials such as Au/Sn, Au/Ge, SAC305, conductive epoxies, and silver sintering.
• Familiarity with gold wire bonding, encapsulation, and inspection processes.
• Prior experience training or mentoring technical staff in a production environment.