Software Engineering Intern

TL;DR

Software Engineering Intern (Thermal Analysis): Designing, developing, troubleshooting and debugging PCB/package/chip thermal analysis software with an accent on numerical analysis techniques, meshing, and finite-element based simulation. Focus on solving extremely complex thermal problems involving CFD analysis and electric cooling optimization.

Location: San Jose

Company

We hire and develop leaders and innovators impacting the world of technology.

What you will do

• Design and develop thermal analysis software for PCBs, packages, and chips.
• Troubleshoot and debug complex issues in thermal simulation tools.
• Analyze situations and data for intangible variance factors in extremely complex problems.

Requirements

• Currently attending BS, MS, or PhD program in ME/EE/CS.
• Strong programming skills in C++ with deep familiarity in object-oriented programming.
• Knowledge of distributed/multi-threaded programming, numerical analysis, meshing techniques, finite-element thermal simulation, CFD analysis, and PCB/package/chip electric cooling preferred.

Nice to have

• Experience with automatic design optimization for thermal targets.

Culture & Benefits

• Work on meaningful projects solving challenges others can't.
• Opportunity to make an impact in technology innovation.