Principal Thermal Design Engineer (AI)

TL;DR

Principal Thermal Design Engineer (AI/Hardware): Designing and developing high-performance thermal solutions for AI networking hardware with an accent on heatsinks, cold plates, and liquid cooling systems. Focus on thermal modeling, simulation, and validation to ensure system reliability for hyperscale AI workloads.

Location: San Francisco, CA or New York City, NY

Salary: $230,000–$260,000

Company

A well-funded, VC-backed AI/networking hardware startup redefining infrastructure for the world’s largest hyperscalers through a Joint Development Model.

What you will do

• Design and develop thermal solutions including heatsinks, cold plates, and liquid cooling systems.
• Perform thermal modeling and simulations using industry-standard tools.
• Lead thermal testing and validation to ensure performance and reliability.
• Collaborate with hardware and system teams to integrate thermal designs.
• Work with suppliers to deliver high-quality thermal components.
• Troubleshoot thermal issues and maintain system reliability.

Requirements

• B.S. in Mechanical Engineering (M.S. preferred) with a focus on heat transfer.
• 10+ years of experience in thermal design.
• 5+ years of experience with datacenter network systems.
• Proficiency in thermal simulation tools such as Flotherm, Flotherm-XT, and IcePak.
• Strong understanding of air cooling techniques (vapor chambers, heat pipes, heat sinks, fans, TIMs).
• Deep knowledge of heat transfer and real-world thermal system design.

Nice to have

• Experience with liquid cooling.