Software Engineering Intern (Semiconductors)

TL;DR

Software Engineering Intern (Embedded): Developing and maintaining next-generation high-volume manufacturing test equipment software with an accent on the software development life cycle and product quality. Focus on implementing new features, driving design and code reviews, and optimizing testing processes.

Location: On-site in Hillsboro, Oregon, USA

Salary: $999 - $999,999 (Standard internship rates apply based on degree and location)

Company

hirify.global is a global leader in semiconductor manufacturing, providing cutting-edge silicon process and packaging technology for the AI era.

What you will do

• Define, develop, and maintain software for High-Volume Manufacturing (HVM) test equipment.
• Participate in all phases of the software development life cycle (SDLC).
• Collaborate with cross-geographic engineering teams across the organization.
• Drive and participate in design and code reviews to ensure software quality.
• Identify opportunities for bug fixes and improvements in product testing processes.

Requirements

• Must be pursuing an MS degree in Electrical Engineering, Computer Science, Computer Engineering, Systems Engineering, Mechanical Engineering, or a related field.
• Must be able to work on-site in Hillsboro, Oregon, USA.
• Strong communication skills and ability to interface with team members and customers.
• Proficiency in data analytics to communicate complex data and identify solutions.

Nice to have

• 1+ years of experience in a laboratory or industrial environment.
• Hands-on experience with Agile software development and validation models.

Culture & Benefits

• Comprehensive compensation package including competitive pay and stock bonuses.
• Full benefit programs covering health, retirement, and vacation.
• Opportunity to work within a worldwide factory network on state-of-the-art technology.
• Collaborative environment focused on technical excellence and ethical hiring practices.