Director of Hardware Engineering (High-Speed Board Design & Signal Integrity)

TL;DR

Director of Hardware Engineering (High-Speed Board Design & Signal Integrity): Leading the design, analysis, and validation of high-speed board-level hardware for advanced SerDes-based systems with an accent on PCB design, signal integrity, and power integrity optimization. Focus on defining board architectures, managing prototype validation, and ensuring high-performance hardware meets timing, reliability, and manufacturability goals.

Location: Onsite in Santa Clara, CA. This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. hirify.global may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.

Salary: $185,390–$277,700 per annum

Company

hirify.global is a semiconductor company providing essential building blocks for data infrastructure across enterprise, cloud, AI, and carrier architectures.

What you will do

• Lead and mentor a high-performance team of hardware engineers focused on PCB design, SI/PI analysis, and board bring-up.
• Define hardware engineering roadmap and standards for high-speed SerDes board designs.
• Oversee high-speed PCB design, including layout, stackup planning, routing, and signal/power integrity optimization.
• Lead signal integrity (SI) and power integrity (PI) simulations.
• Manage the full hardware lifecycle: concept, schematic, layout, prototype, testing, and production release.
• Coordinate with IC, firmware, and system teams to ensure end-to-end signal and power performance.

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering or related field.
• 12+ years of hardware engineering experience, including 5+ years in leadership or management.
• Deep expertise in high-speed PCB layout, SerDes board-level design, and SI/PI analysis.
• Familiarity with SI/PI simulation tools (e.g., HyperLynx, Ansys SIwave, CST, Keysight ADS).
• Strong understanding of power delivery networks, signal integrity, and high-speed design constraints.
• Proven track record in leading hardware teams from concept through production for high-speed systems.

Culture & Benefits

• Comprehensive benefits package including financial well-being, family support, and mental/physical health resources.
• Employee stock purchase plan with a 2-year look back.
• Family support programs and robust mental health resources.
• Recognition and service awards program.
• Committed to diversity and inclusion, offering reasonable accommodation during the selection process.

Hiring process

• Candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.
• Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.