Software Engineering Intern - Summer 2026 (Warsaw)

TL;DR

Software Engineering Intern - Summer 2026 (Warsaw): Learning and contributing to software development across product, infrastructure, and mobile teams with an accent on developing clean code and foundational engineering principles. Focus on making a real impact by building new features, testing infrastructure, and designing data models in a fast-growing tech company.

Location: This role is based in our Warsaw office with an office-centric hybrid schedule. You’ll work from the office in person on Mondays, Tuesdays, and Thursdays, with the option to work from home on Wednesdays.

Salary: 100 PLN gross per hour

Company

hirify.global is a leading platform that helps teams orchestrate their work and achieve goals faster, fostering human + AI collaboration.

What you will do

• Learn full-time software development in a fast-growing tech company.
• Make a real impact by contributing to various projects like building new features, testing infrastructure, or designing data models.
• Experience growth and development by being paired with a mentor.
• Help maintain the codebase and an award-winning culture.
• Develop clean, beautiful code and leave it better than you found it.
• Participate in hirify.global’s culture of transparency by providing peer feedback to team members.

Requirements

• Anticipated graduation date between December 2026 and July 2027.
• A constant desire to learn and improve.
• A foundational understanding of software development or computer science skills.
• Passion for creating a user-friendly experience, down to the little details.
• Appreciate productivity and care deeply about helping teams collaborate more effectively and efficiently.

Culture & Benefits

• Career coaching & support.
• In-office culinary options to cater to dietary preferences.
• Support by a growth-oriented team.
• Culture of transparency and distributed responsibility.
• Commitment to building inclusive teams and culture.
• Flexible, office-centric hybrid working model.