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У роли четкая senior-зона ответственности в жидкостном охлаждении AI-оборудования, включая полный цикл разработки и запуск в производство; при этом обязательный офисный формат и отсутствие данных о зарплате оставляют важные условия неясными.
?Только офис
Понятная зона ответственности
Инфраструктура для AI
?Высокий порог опыта
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Текст:
Hirify AI/Оригинал
TL;DR
Staff AI Systems Thermal Engineer (AI liquid cooling): Leading the end-to-end thermal design, simulation, optimization, and physical validation of Direct-to-Chip liquid cooling solutions for next-generation AI accelerators and high-density compute platforms with an accent on CFD modeling, cold plate design, thermal interface materials, and hydraulic integration. Focus on designing high-performance cooling systems, correlating simulations with lab testing, and driving thermal solutions from concept through high-volume manufacturing.
Location: San Jose, California, United States
Company
hirify.global develops semiconductor and infrastructure technology products.
What you will do
Lead end-to-end thermal design, simulation, optimization, and physical validation of Direct-to-Chip liquid cooling solutions for AI accelerators and high-density compute platforms.
Build CFD and thermal-resistance network models to evaluate temperature distribution, pressure drop, and flow balancing across cold plates, trays, and racks.
Design and optimize liquid cold plates, coolant flow paths, quick-disconnects, hoses, manifolds, and retention mechanisms in alignment with server chassis and OCP standards.
Research advanced cooling technologies and create integration and test plans for production deployment.
Specify and qualify thermal interface materials for large, high-warpage devices.
Plan and execute lab validation using thermal instrumentation, pressure and flow mapping, thermal test vehicles, and simulation-to-test correlation while collaborating with engineering and manufacturing teams.
Requirements
Bachelor’s or Master’s degree in Mechanical or Thermal Engineering, or equivalent; an M.S. is preferred.
Bachelor’s degree plus 8+ years of experience, or Master’s degree plus 6+ years of experience.
Hands-on thermal or mechanical design experience for high-power electronics, AI hardware, servers, or HPC systems.
Direct experience designing and deploying Direct Liquid Cooling systems, including liquid cold plates, coolant distribution units, and manifold loops.
Deep understanding of single-phase and/or two-phase heat transfer, fluid dynamics, pressure-drop calculations, and electronics packaging interactions.
High proficiency with CFD and thermal analysis software, preferably Flotherm, FloEFD, and MacroFlow.
Experience with thermal data acquisition systems, flow meters, pressure transducers, and lab automation using Python, MATLAB, or LabVIEW.
Experience with electronics packaging and CAD platforms; Creo experience is preferred.
Nice to have
Experience with air-cooled systems.
Master’s degree in Mechanical or Thermal Engineering.
Creo experience.
Culture & Benefits
Full-time onsite position in San Jose, California.
Medical, dental, and vision plans; 401(k) participation with company matching.
Discretionary annual bonus, competitive new-hire equity grant, and potential annual equity awards subject to applicable plans and agreements.
Paid family leave and other legally applicable leaves of absence.
Hiring process
First-time applicants must create a candidate login account before applying; existing candidates must sign in before applying.
Applicants located outside the USA should provide a home address for future correspondence.
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