New Mexico Wafer Packaging Manufacturing Advanced Packaging Die Pick Engineering Group Leader (Semiconductor Manufacturing)
Контакты
120 860 - 231 670$
Формат работы
onsite
Тип работы
fulltime
Грейд
lead
Английский
b2
Страна
US
process optimizationlean manufacturingengineering leadershipadvanced packaginghigh volume manufacturingsemiconductor manufacturingmanufacturing process improvementdie pick
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Зарплата и рынок
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$121к-232к/год
$150к$180кмедиана$190к
По похожим ролям (50) ~ $180к/год
На СНГ рынке: $2.3к/мес ($1.8к - $2.9к)
86
Хорошая вакансия
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В Company hidden это четко очерченная руководящая инженерная роль в передовом производстве полупроводников с ответственностью за развитие команды и запуск нового оборудования.
Передовое производство
Понятная зона ответственности
Крупный производитель
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
New Mexico Wafer Packaging Manufacturing Advanced Packaging Die Pick Engineering Group Leader (Semiconductor Manufacturing): Leading engineering teams supporting high-volume wafer packaging manufacturing and next-generation Die Pick toolsets with an accent on process improvement, technology transfer, and operational excellence. Focus on qualifying and ramping Early Tool Sets, troubleshooting integrated process and equipment challenges, and developing manufacturing strategies for improved safety, quality, yield, and productivity.
Location: On-site in Albuquerque, New Mexico, United States
Annual salary: $120,860–$231,670 USD
Company
hirify.global develops semiconductor and advanced packaging technologies and operates high-volume manufacturing processes across its global manufacturing network.
What you will do
Lead and manage engineers supporting safe, high-volume manufacturing while improving quality, output, cost, and yield.
Set tactical priorities for sustaining operations, troubleshooting, process characterization, and optimization.
Collaborate with engineering and manufacturing teams on integrated process and equipment challenges.
Develop engineers’ technical and leadership capabilities, including hands-on expertise in owned modules.
Facilitate technology transfer, matched processing across global sites, training, and audits.
Oversee Early Tool Set installation, qualification, factory-transition ramp production, and qualification of next-generation Die Pick toolsets.
Requirements
Bachelor’s degree in engineering, materials science, physics, or a related technical field with 6+ years of relevant experience.
At least 2 years of experience leading an engineering or manufacturing team, including team leadership, performance management, and delivery against organizational goals.
Experience with process characterization, troubleshooting, and process improvement in a high-volume manufacturing environment.
Experience with manufacturing practices and lean manufacturing principles.
Nice to have
4+ years of experience with a master’s degree, or 2+ years of experience with a PhD.
Extensive engineering-team leadership experience focused on operational excellence and innovation.
Advanced knowledge of semiconductor processing or packaging technologies.
Experience collaborating with vendors and delivering cross-functional results.
Strong communication and leadership skills, including experience empowering diverse teams.
Experience developing and implementing strategic plans to improve engineering capabilities and manufacturing efficiency.
Culture & Benefits
On-site Shift 1 role in the United States.
Inclusive work environment focused on innovation, disciplined execution, and operational excellence.
Benefits include health coverage, retirement, vacation, competitive pay, and stock bonuses.
Hiring follows Responsible Business Alliance compliance and ethical recruitment practices; candidates are not charged recruitment or employment-related fees.
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