Process Engineer for Bevel Management (Semiconductor)
Контакты
Формат работы
onsite
Тип работы
fulltime
Английский
b2
Страна
Belgium
data analysisproject managementmetrologyfailure analysiscleanroommaterials characterizationsemiconductor processingchemical mechanical planarizationwafer bevel management
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Крутая вакансия
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Чётко очерченная практическая инженерная роль в ведущем центре полупроводниковых исследований, с доступом к передовому оборудованию, междисциплинарным проектам и поддержкой развития.
Передовые исследования
Понятные задачи
Поддержка развития
?Работа в чистой комнате
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Process Engineer for Bevel Management (Semiconductor): Developing wafer bevel management processes for advanced semiconductor packaging and research programs with an accent on trimming, deposition, etching, polishing, and materials characterization. Focus on starting and transferring semiconductor equipment and processes, validating metrology approaches, performing failure analysis, and coordinating multidisciplinary development with researchers, fab teams, and industrial partners.
Location: Leuven, Belgium; primarily hands-on work in a cleanroom at hirify.global's headquarters.
Company
hirify.global is a nanotechnology research center developing semiconductor, advanced packaging, wafer-level integration, MEMS, photonics, biomedical, and quantum technologies.
What you will do
Develop a strategy for wafer bevel management using trimming, deposition, etching, and polishing techniques.
Start up state-of-the-art semiconductor equipment and develop training plans for equipment and process operation.
Define, organize, validate, and transfer materials, processes, tools, and non-standard work within the fab organization.
Apply metrology solutions to characterize materials and perform characterization and failure analysis.
Contribute to research and joint development programs involving 3D integrated systems, 3D memory, image sensors, photonics, biomedical devices, and quantum computing.
Collaborate with researchers, scientists, hardware engineers, process and integration teams, fab engineers, equipment vendors, industrial partners, and external research partners; report results through internal communication, conferences, and journal publications.
Requirements
Master's degree in engineering technology, mechanical engineering, chemistry, physics, or materials science.
Project management skills and the ability to work independently with a strong focus on quality.
Strong communication, networking, reporting, organization, attention to detail, and teamwork skills.
Ability to work hands-on in a cleanroom and collaborate in a multicultural, cross-functional environment.
Flexible attitude toward varied activities driven by hirify.global research program needs.
Good spoken and written English is required.
Nice to have
Relevant experience in a research or industrial environment.
Knowledge of nanotechnology, chemical or mechanical process technology, CMP, plasma etching, or deposition processes.
Foundry or OSAT experience and a semiconductor materials background, including characterization and failure analysis.
Knowledge of data analysis and big data treatment.
Culture & Benefits
Open, inclusive, multicultural, and informal working environment.
Opportunities to take initiative, show responsibility, and work with hirify.global researchers, PhD students, and industrial researchers.
On-the-job coaching by senior engineers.
Technical and personal development through hirify.global.academy.
Market-appropriate salary with fringe benefits.
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