Team Lead for Electrical Engineering (Semiconductor Capital Equipment)

Location: On-site in San Diego, California, United States. A flexible workplace arrangement may be available for eligible roles, with up to two remote days per week, but this position requires on-site presence for in-person work events, training, and meetings. Travel domestically and internationally is required as needed.

Base annual salary: $146,250–$214,500.

Company

hirify.global develops, integrates, markets, and services lithography machines used by leading chipmakers to produce smaller, more powerful, and energy-efficient microchips.

What you will do

• Lead, mentor, and develop a team of 5–10 electrical engineers through one-to-ones, development plans, technical mentoring, performance feedback, and career discussions.
• Shape technical direction and priorities while partnering with architects, systems engineers, project leaders, manufacturing, sourcing, quality, and customer service.
• Drive electrical and electromechanical product development from requirements and design reviews through prototyping, verification, qualification, release, and manufacturing.
• Provide technical oversight for system architecture, schematics, PCA/PWB development, component selection, interfaces, subsystem integration, and verification strategies.
• Lead structured problem-solving, risk assessments, DFMEA/PFMEA, technical readiness reviews, and data-driven engineering decisions.
• Manage workforce planning, resource allocation, project schedules, risks, budgets, engineering commitments, competency development, and continuous improvement.

Requirements

• Bachelor’s degree in Electrical Engineering.
• 8+ years of relevant experience, or a Master’s degree with 6+ years of relevant experience.
• Experience designing, fabricating, testing, and releasing electronics and electromechanical modules for capital equipment; semiconductor capital equipment experience is strongly desired.
• Background in EMC, pulsed power, FPGA/digital design, mixed-signal circuits, DOE, PCA/B fabrication, RoHS requirements, and component qualification.
• Hands-on experience with schematic capture and PCB layout tools such as OrCAD or Mentor Graphics/PADS.
• Familiarity with PLM and component management tools such as Oracle Agile, AVCOM, or Silicon Expert.
• Knowledge of high-volume manufacturing documentation, BOM management, ECO processes, vendor interfacing, and prototyping logistics.
• Ability to manage schedules and deliverables in a fast-paced, multi-task environment, balance hands-on engineering with delegation, and coordinate resources across projects.
• Strong analytical, communication, customer-facing, cross-functional collaboration, leadership, and team-building skills, with experience in structured product development and gated design cycles.
• Must be legally authorized to access United States-controlled technology before beginning work.
• Must be willing to work in a clean room while wearing required protective equipment for the entire shift.

Nice to have

• Experience with simulation tools such as PSpice or MATLAB.
• Experience with semiconductor capital equipment development.

Culture & Benefits

• Collaborative, inclusive, engaging, and high-performing engineering culture focused on ownership, innovation, technical excellence, and career growth.
• Medical, dental, vision, and basic life insurance for employees and their families.
• 401(k) plan, eight hours of vacation leave per month, and 13 paid holidays annually.
• Work includes occasional movement around campus, lifting or moving up to 20 pounds, and physical activities such as walking, reaching, kneeling, and stretching.
• Equal opportunity employment and reasonable accommodation support are provided.

Hiring process

• All new hirify.global jobs have a minimum application deadline of 10 days.
• Applicants requiring accommodation may contact USHR_Accommodation@hirify.global.com to initiate the accommodation process.