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6 дней назад

CryoCMOS Design Director, Quantum (CryoCMOS)

166 500 - 319 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
director
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
CryoCMOS Design Director, Quantum (CryoCMOS): Leading a multidisciplinary team developing advanced cryogenic CMOS ICs and reusable design solutions with an accent on architecture, mixed-signal design, verification, tapeout, and silicon characterization. Focus on building a CryoCMOS design capability, translating process technology into manufacturable quantum IC solutions, and delivering complex programs through design-to-silicon correlation.

Location: Austin, United States of America; other location: Santa Clara, United States of America. Full-time onsite role with up to 10% travel.

Expected salary: $166,500–$319,000 per year.

Company

hirify.global is a semiconductor foundry providing design, development, and fabrication services with a global manufacturing footprint.

What you will do

  • Lead a multidisciplinary CryoCMOS IC design team of approximately 10–20 engineers across analog, RF, digital, mixed-signal, and physical design.
  • Direct end-to-end IC and reusable IP development from system and circuit architecture through simulation, physical implementation, verification, tapeout, silicon bring-up, and characterization.
  • Provide technical direction through design reviews, methodology development, performance optimization, design closure, risk identification, and resolution of critical issues.
  • Develop CryoCMOS, quantum, and other advanced IC solutions, reusable IP, design methodologies, and enablement capabilities using GF process technologies.
  • Partner with PDK, compact modeling, technology development, test, packaging, design enablement, customers, and ecosystem partners.
  • Build the engineering organization through recruiting, coaching, mentorship, performance management, succession planning, and development of technical leaders.

Requirements

  • Bachelor’s degree in Electrical Engineering, Computer Engineering, Microelectronics, Applied Physics, or a related technical field.
  • At least 10 years of relevant semiconductor IC design experience, including progressively increasing technical leadership responsibilities.
  • Experience leading and managing IC design teams, preferably multidisciplinary teams spanning analog, mixed-signal, RF, digital, and/or physical design.
  • Experience leading complex IC development through architecture, design, verification, physical implementation, tapeout, silicon bring-up, characterization, and design-to-silicon correlation.
  • Strong understanding of CMOS IC design, semiconductor devices, design methodologies, physical implementation, verification, PVT variation, parasitic effects, and silicon characterization.
  • Ability to manage multiple complex IC activities, prioritize resources, mitigate technical and program risks, and deliver against schedules.
  • Ability to recruit, develop, coach, and retain high-performing engineering teams and technical leaders.
  • Ability to communicate technical topics, priorities, risks, and recommendations across engineering teams, customers, management, and senior leadership.
  • Written and verbal fluency in English; willingness to travel up to 10%.

Nice to have

  • Master’s degree or PhD in Electrical Engineering, Microelectronics, Computer Engineering, Applied Physics, or a related field.
  • Experience leading IC design organizations of 10 or more engineers and multidisciplinary teams.
  • Experience with cryoCMOS, quantum-control/readout electronics, low-temperature electronics, or other advanced semiconductor applications.
  • Deep expertise in analog/mixed-signal, RFIC, digital IC, or high-speed circuit design with breadth across multidisciplinary IC development.
  • Experience with semiconductor technology development, PDK, compact modeling, EDA, test, packaging, and silicon characterization teams.
  • Experience establishing or scaling IC design capabilities, including methodologies, reusable IP, design flows, technical reviews, and tapeout practices.
  • Experience translating system-level requirements into semiconductor technology and IC design solutions with customers and ecosystem partners.
  • Project management, innovation, execution, planning, organizational, and strong written and verbal communication skills.

Culture & Benefits

  • Work in a multidisciplinary semiconductor engineering environment focused on cryogenic, quantum, and advanced applications.
  • Collaboration spans technology development, design enablement, customers, and ecosystem partners.
  • Employment is subject to applicable pre-employment conditions and may require applying for a U.S. Department of Defense Security Clearance if requested.
  • Reasonable accommodations are available during the employment process.
  • hirify.global maintains equal-opportunity employment practices.

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