team leadershipphysical designdigital designanalog designrf designmixed signal designcmossilicon characterizationcryocmosquantum electronics
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
Пожаловаться
Зарплата и рынок
$167к-319к/год
$210к$240кмедиана$260к
По похожим ролям (50) ~ $240к/год
88
Крутая вакансия
развернуть
Чёткая руководящая роль с ответственностью за весь цикл разработки передовых микросхем и фокусом на квантовых и криогенных технологиях обещает высокий уровень влияния; работа в офисе и возможное оформление допуска к секретной информации ограничивают привлекательность для части специалистов.
Кликните для подробной информации
Только офисВозможен допускКвантовые технологииПолная ответственность
Оценка от Hirify AI
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Подключить Plus
Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
CryoCMOS Design Director, Quantum (CryoCMOS): Leading a multidisciplinary team developing advanced cryogenic CMOS ICs and reusable design solutions with an accent on architecture, mixed-signal design, verification, tapeout, and silicon characterization. Focus on building a CryoCMOS design capability, translating process technology into manufacturable quantum IC solutions, and delivering complex programs through design-to-silicon correlation.
Location: Austin, United States of America; other location: Santa Clara, United States of America. Full-time onsite role with up to 10% travel.
Expected salary: $166,500–$319,000 per year.
Company
hirify.global is a semiconductor foundry providing design, development, and fabrication services with a global manufacturing footprint.
What you will do
Lead a multidisciplinary CryoCMOS IC design team of approximately 10–20 engineers across analog, RF, digital, mixed-signal, and physical design.
Direct end-to-end IC and reusable IP development from system and circuit architecture through simulation, physical implementation, verification, tapeout, silicon bring-up, and characterization.
Provide technical direction through design reviews, methodology development, performance optimization, design closure, risk identification, and resolution of critical issues.
Develop CryoCMOS, quantum, and other advanced IC solutions, reusable IP, design methodologies, and enablement capabilities using GF process technologies.
Partner with PDK, compact modeling, technology development, test, packaging, design enablement, customers, and ecosystem partners.
Build the engineering organization through recruiting, coaching, mentorship, performance management, succession planning, and development of technical leaders.
Requirements
Bachelor’s degree in Electrical Engineering, Computer Engineering, Microelectronics, Applied Physics, or a related technical field.
At least 10 years of relevant semiconductor IC design experience, including progressively increasing technical leadership responsibilities.
Experience leading and managing IC design teams, preferably multidisciplinary teams spanning analog, mixed-signal, RF, digital, and/or physical design.
Experience leading complex IC development through architecture, design, verification, physical implementation, tapeout, silicon bring-up, characterization, and design-to-silicon correlation.
Strong understanding of CMOS IC design, semiconductor devices, design methodologies, physical implementation, verification, PVT variation, parasitic effects, and silicon characterization.
Ability to manage multiple complex IC activities, prioritize resources, mitigate technical and program risks, and deliver against schedules.
Ability to recruit, develop, coach, and retain high-performing engineering teams and technical leaders.
Ability to communicate technical topics, priorities, risks, and recommendations across engineering teams, customers, management, and senior leadership.
Written and verbal fluency in English; willingness to travel up to 10%.
Nice to have
Master’s degree or PhD in Electrical Engineering, Microelectronics, Computer Engineering, Applied Physics, or a related field.
Experience leading IC design organizations of 10 or more engineers and multidisciplinary teams.
Experience with cryoCMOS, quantum-control/readout electronics, low-temperature electronics, or other advanced semiconductor applications.
Deep expertise in analog/mixed-signal, RFIC, digital IC, or high-speed circuit design with breadth across multidisciplinary IC development.
Experience with semiconductor technology development, PDK, compact modeling, EDA, test, packaging, and silicon characterization teams.
Experience establishing or scaling IC design capabilities, including methodologies, reusable IP, design flows, technical reviews, and tapeout practices.
Experience translating system-level requirements into semiconductor technology and IC design solutions with customers and ecosystem partners.
Project management, innovation, execution, planning, organizational, and strong written and verbal communication skills.
Culture & Benefits
Work in a multidisciplinary semiconductor engineering environment focused on cryogenic, quantum, and advanced applications.
Collaboration spans technology development, design enablement, customers, and ecosystem partners.
Employment is subject to applicable pre-employment conditions and may require applying for a U.S. Department of Defense Security Clearance if requested.
Reasonable accommodations are available during the employment process.
Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →