Senior Hardware Engineer (AI)

Location: Pavia, Lombardy, Italy; office work in Pavia is required, with mobile work possible.

Salary: €67,040–€100,560 annually.

Company

hirify.global is a semiconductor manufacturer providing process technology, design, development, and manufacturing services across the U.S., Europe, and Asia.

What you will do

• Define hardware and system-level requirements for advanced power-delivery ASIC solutions.
• Drive development and integration across ASIC, package, PCB, and system levels.
• Collaborate with package designers, OSAT partners, PCB designers, IC design teams, customers, and system engineers to optimize performance, manufacturability, and reliability.
• Evaluate electrical, thermal, and mechanical constraints in high-performance electronic systems.
• Translate customer application requirements into technical specifications and engineering solutions.
• Lead hardware bring-up, characterization, debugging, root-cause analysis, validation strategies, technical reviews, and product realization.

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, or a related technical discipline.
• 5+ years of experience in hardware, system, or power electronics design within the semiconductor, power management, or high-performance computing industry.
• Proven experience developing and bringing up complex PCB- and semiconductor-based systems.
• Strong understanding of power electronics, power-delivery architectures, and system integration across ASIC, package, PCB, and system levels.
• Good knowledge of PCB design principles, including power distribution networks, signal integrity, and power integrity.
• Experience with hardware characterization, laboratory debugging, validation, and failure analysis.
• Understanding of thermal and mechanical considerations in high-performance electronic systems.
• Strong analytical, problem-solving, communication, and cross-functional collaboration skills.
• Fluent written and spoken English.
• Willingness to work in the Pavia office; mobile work is possible.

Nice to have

• Experience with advanced semiconductor packaging technologies and OSAT partners.
• Familiarity with high-current, high-power-density applications.
• Experience with power-delivery solutions for AI accelerators, GPUs, CPUs, or data-center platforms.
• Experience interacting directly with customers and translating system requirements into engineering solutions.

Culture & Benefits

• Work within a multidisciplinary engineering team.
• Collaborate with global semiconductor, packaging, PCB, system, and customer stakeholders.
• Mobile work is possible alongside office work in Pavia.
• Employment is subject to applicable pre-employment conditions and laws.
• Equal-opportunity workplace with a stated commitment to cultural diversity and non-discrimination.