Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Текст:
Hirify AI/Оригинал
TL;DR
Sr. Staff Engineer - PCB Design (High-Speed/RF PCB): Designing and documenting high-density printed circuit boards for broadband network hardware with an accent on high-speed digital, RF, analog, micro-via, and sequential lamination technologies. Focus on resolving fabrication and assembly constraints, optimizing DFM, presenting design trade-offs, and coordinating multiple PCB projects with engineering and manufacturing teams.
Location: Apodaca, Mexico
Company
hirify.global develops broadband network hardware and next-generation electronic assemblies.
What you will do
Design and document high-density PCB layouts from schematics and electrical and mechanical constraints, following manufacturing standards and design guidelines.
Develop PCB layouts for broadband network designs across R&D, Access Technologies, and Broadband Networks.
Support form factor accurate test platform boards involving digital processors, RF amplifier circuits, and power control devices.
Work with stacked micro-vias, sequential lamination stack-ups, and packages with 0.5 mm pitch and smaller.
Collaborate with US and Mexico engineering teams, manufacturing, fabrication and assembly vendors, and internal PCB designers.
Present design reviews and trade-offs, resolve PCB issues, improve DFM processes and checklists, and manage multiple projects.
Requirements
Bachelor’s degree in electrical engineering, electronics engineering technology, or a related technical field.
8+ years of active experience in high-speed PCB design and RF mixed technologies.
Experience with Design for Manufacture analysis using Valor and/or CAM350, including Valor.
Proficiency with Siemens/Mentor Xpedition PCB design software.
Experience with RF, analog, and high-speed digital circuit design, including DDR2/3/4/5.
Expert knowledge and demonstrated application of PCB design principles, practices, and industry standards.
Ability to perform complex PCB design tasks involving fabrication and assembly process capabilities and limitations.
Experience with EMI mitigation techniques and practices.
Familiarity with PWB technology and process trends and their application to advanced designs.
Strong verbal and written communication skills, including clear status reports and presentations; effective collaboration with cross-functional teams and external suppliers; and the ability to align individual contributions with project goals.
Culture & Benefits
Work with electrical and mechanical engineering teams on next-generation hardware.
Collaborate with teams across the United States and Mexico.
Operate in a fast-paced, dynamic environment with multiple concurrent projects.
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