Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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В Company hidden это четко очерченная senior-роль в разработке продукта с ответственностью за полный цикл и тесной работой разных команд, хотя быстрый темп и поддержка изделий в эксплуатации могут расширять нагрузку.
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Полный цикл продуктаВысокий уровеньХороший соцпакетВысокий темп
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Мэтч & Сопровод
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Staff R&D Engineer Mechanical (Electronics Packaging): Designing and delivering rack-level and tray-level mechanical enclosures, including full chassis for high-performance power electronic products, with an accent on electronics packaging, thermal management, manufacturing, and lifecycle ownership. Focus on developing liquid-cooled high-power enclosures, solving complex thermal and power delivery challenges, and taking products from concept through volume production and sustaining.
Location: Ottawa March Road, Canada
Company
hirify.global develops high-performance and power electronic products supported by multidisciplinary hardware, ASIC, signal, mechanical, thermal, diagnostic, packaging, and manufacturing engineering teams.
What you will do
Design rack-level and tray-level mechanical enclosures from concept through detailed design, including chassis appearance, component selection, tolerance analysis, DFM analysis, documentation, and prototype builds.
Develop PCB-related mechanical solutions and address complex thermal and power delivery challenges with multidisciplinary engineering teams.
Apply advanced manufacturing technologies to create cost-effective, production-level designs compliant with regulatory requirements and data center best practices.
Support prototype builds, testing, troubleshooting, product qualification, customer trials, field issues, and product sustaining.
Prepare engineering drawings, bills of materials, change orders, and other product documentation.
Collaborate with partner engineering teams and cross-functional production and support groups throughout the product lifecycle.
Requirements
Bachelor’s degree in Mechanical Engineering.
8+ years of experience in electronics packaging.
Proficiency in PTC Creo and Windchill for 3D modeling, design, and data management.
Experience with sheet metal, machining, die-casting, and plastic manufacturing techniques.
Experience designing high-powered enclosures and devices, including liquid cooling requirements and challenges.
Proven collaboration with production shops and manufacturing teams to streamline processes, improve quality control, and transition designs into implementation.
Understanding of relevant US, European, and Asian regulations, standards, and best practices for safety and environmental compliance.
Demonstrated lifecycle ownership of complex products from inception through volume production.
Experience working with Sales, Marketing, Purchasing, Manufacturing, Customer Support, Compliance, Safety, and Sustainability groups.
Culture & Benefits
Fast-paced, startup-like environment with small, highly experienced teams.
Cradle-to-grave product ownership extending beyond shipment into customer trials, field issues, and product sustaining.
Discretionary annual bonus and competitive new-hire and annual equity awards, subject to applicable plan documents and agreements.
Medical, dental, and vision plans; RRSP participation with company matching; Employee Stock Purchase Program; and Employee Assistance Program.
Company-paid holidays, paid sick leave, and vacation time in accordance with applicable laws.
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