Master Thesis, 30 HP: Shock and Vibration Strength of Electronic Circuit Boards (Structural Analysis)

Location: Linköping, Sweden. Onsite thesis project. The applicant must be granted security clearance in accordance with national law; additional citizenship obligations may apply.

Company

hirify.global is a defense and security company developing, manufacturing, and maintaining systems in aeronautics, weapons, command and control, sensors, and underwater systems.

What you will do

• Develop modelling methods for analyzing and predicting the structural strength of electronic circuit boards.
• Study structural failure of circuit boards and the structural and electronic bonding of components to circuit boards.
• Analyze the effects of shocks, impacts, and vibrations on electronic circuit boards.
• Conduct drop tests to verify the modelling methods.
• Collaborate with experienced engineers and specialists in hirify.global's Underwater Systems organization.

Requirements

• Be at the end of a master's degree in mechanical engineering, applied physics, or an equivalent field and be ready to start a 30 HP master's thesis.
• Have completed basic- and advanced-level courses in applied physics and structural mechanics.
• Have knowledge of computational methods such as the Finite Element Method.
• Have an interest in applied physics and structural analysis.
• Be able to pass security vetting in accordance with current security-protection regulations.

Nice to have

• Conduct the thesis as a cooperation between two students; the scope can also be adapted for one student.

Culture & Benefits

• Receive support and guidance for translating theoretical knowledge into practical solutions.
• Work with experienced engineers and specialists on underwater products for civil and defense markets.
• Contribute to products designed to withstand demanding operating conditions, including shocks and vibrations.

Hiring process

• The recruitment process is ongoing and the position may be filled before the closing date.
• Closing date: 1 November 2026.