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3 дня назад

Hardware Design Engineer (High-Speed PCB)

150 680 - 225 700$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior/lead
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Hardware Design Engineer (High-Speed PCB): Designing, implementing, and bringing up complex high-speed boards and networking platforms integrating silicon, packaging, and optics with an accent on PCB layout, signal integrity, power integrity, and system-level architecture. Focus on leading board development from concept to production, debugging with advanced lab equipment, and resolving complex design and manufacturability issues across cross-functional engineering teams.

Location: Santa Clara, CA, United States

Expected base pay: $150,680–$225,700 per annum, plus eligibility for bonus and equity plans.

Company

hirify.global develops semiconductor solutions for data infrastructure across enterprise, cloud and AI, carrier, communications, and critical infrastructure markets.

What you will do

  • Design and develop complex high-speed boards and networking platforms spanning board, switch, and optics solutions.
  • Own schematic capture, PCB layout, board builds, bring-up, testing, and delivery against technical and business requirements.
  • Drive system-level decisions covering power, thermal design, signal integrity, power integrity, reliability, and manufacturability.
  • Lead hardware engineers and technicians through planning, design, build, test, debug, and production delivery.
  • Perform hands-on lab bring-up and debug using oscilloscopes, logic analyzers, and other test equipment.
  • Collaborate with circuit, packaging, validation, software, marketing, FAE, PCB vendor, ODM, and contract manufacturing teams to resolve design issues and maintain quality and schedules.

Requirements

  • Bachelor’s degree in Electrical Engineering, Computer Science, or a related field with 10–15 years of relevant experience, or a master’s degree and/or PhD with 5–10 years of experience.
  • Direct experience designing high-speed, high-density PCBs with DDR3/4/5, PCIe Gen3/4/5, SATA3, SPI, and I2C interfaces.
  • Experience leading small teams of hardware or design engineers from concept through production.
  • Experience with PAM4, DDR5, PCIe Gen5 routing, routing strategies, large board formats, layer-count and stack-up optimization.
  • Familiarity with Cadence Allegro and OrCAD schematic capture and PCB layout tools, plus signal integrity, power integrity, power supply design, and hands-on measurement.
  • Strong board bring-up, debug, analytical, problem-solving, communication, mechanical, and thermal design skills.

Culture & Benefits

  • Work in a highly visible technical environment on complex cross-functional platform programs.
  • Employee stock purchase plan with a two-year look back.
  • Family support programs and mental and physical health resources.
  • Recognition and service awards, plus bonus and equity opportunities.
  • Reasonable accommodations are available during the selection process.

Hiring process

  • Interviews evaluate individual experience, thought process, and communication in real time.
  • AI tools, transcription applications, automated answer generators, and automated note-taking bots are not permitted during interviews.
  • The role may require an export license review for applicants who are not U.S. citizens, lawful permanent residents, or protected individuals, depending on access to export-controlled technology.

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