Hardware Research Analyst (AI)

Location: Hillsboro, Oregon, United States; 80% onsite with an in-office/hybrid work setting. US work authorization is required; visa sponsorship is not available.

Company

hirify.global is an independent research and analysis firm covering the semiconductor and AI industries across the technology supply chain.

What you will do

• Own AI and datacenter hardware products from acquisition planning and teardown strategy through laboratory analysis and publication.
• Publish technical research supported by complete teardown data, analysis, and technical prose.
• Analyze silicon process and die architecture, packaging, memory, power delivery, interconnects, boards, systems, and cost.
• Operate the laboratory toolchain and direct specialized analytical work, including sample preparation and microscopy.
• Track conferences, papers, patents, product launches, and supply-chain signals and incorporate findings into reports.
• Build expert networks and translate physical evidence into architectural intent, cost structures, and roadmap implications.

Requirements

• At least 2 years of experience in hardware or silicon engineering, system architecture, or technical industry analysis is preferred; candidates at any experience level may apply.
• Experience with leading-edge hardware and broad knowledge of GPUs, CPUs, accelerators, memory, networking, power delivery, and packaging from die to rack.
• Strong technical writing skills with published articles, papers, or substantial long-form technical documents to show.
• Ability to reason across device, circuit, architecture, system, workload, and cost layers.
• Hands-on experience with or strong aptitude for semiconductor sample preparation and tools such as precision polishing, FIB, SEM, electron-beam, X-ray, and compositional analysis methods.
• US work authorization required; visa sponsorship is not available.

Nice to have

• Engineering experience in silicon or systems design, architecture, validation, debug, failure analysis, or manufacturing.
• Experience interpreting micrographs, die imagery, and electrical measurements.
• Knowledge of cost modeling, advanced packaging, 2.5D/3D integration, hybrid bonding, HBM, or co-packaged optics.
• Python experience for data analysis, image analysis, data pipelines, or automation.
• Public technical writing, conference participation, or a strong professional network of industry experts.

Culture & Benefits

• Work with a global group of analysts covering the semiconductor supply chain and AI ecosystem.
• Contribute to bylined reports, conference engagement, and a public research profile.
• Develop hands-on depth across the laboratory analytical toolchain.
• Collaborate with research, manufacturing, and market teams on strategic technical insight.
• Progress toward a lead analyst or subject matter expert role with influence over research direction.