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10 дней назад

Edge & Physical AI HW Product Manager/Director (AI)

Формат работы
onsite
Тип работы
fulltime
Грейд
director
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Edge & Physical AI HW Product Manager/Director (AI): Defining and managing multi-generational NPU hardware products, chiplet-based architectures, and integrated NPU IP with an accent on silicon specifications, product roadmaps, and customer-driven architecture decisions. Focus on optimizing performance, power, memory, packaging, cost, and interconnect tradeoffs while building business cases and driving adoption across product generations.

Location: Chandler, United States (office)

Company

hirify.global develops semiconductor and silicon IP solutions for embedded, automotive, industrial, and edge applications.

What you will do

  • Define and maintain multi-generational hardware roadmaps for discrete NPUs, integrated NPU IP, and chiplet-based scale-out architectures.
  • Translate customer requirements and competitive intelligence into silicon specifications covering performance, memory, power, I/O, packaging, safety, and process nodes.
  • Drive architecture reviews, design partitioning, feature tradeoffs, and NPU integration with i.MX, S32 SoC, i.MCU, and RT product teams.
  • Own product business cases covering BOM cost, ASP, gross margin, volume projections, NPV, and investment recommendations.
  • Lead make-versus-buy-versus-license evaluations, chiplet strategy, customer sampling, competitive benchmarking, and product lifecycle management.
  • Represent the NPU hardware portfolio to executives, customers, partners, and industry audiences while co-owning software development and demonstration platforms.

Requirements

  • 10+ years of product management or product strategy experience in semiconductors or silicon IP.
  • Direct experience defining hardware product specifications, including performance targets, memory architecture, power envelopes, packaging, and process nodes.
  • Strong understanding of SoC and IP integration, including defining IP for host processor or SoC integration.
  • Experience driving design wins and customer adoption across multiple product generations.
  • Ability to build and defend business cases involving BOM cost, ASP, gross margin, and market sizing.
  • Strong cross-functional leadership and communication skills across architecture, engineering, sales, marketing, customers, and executive stakeholders.

Nice to have

  • Experience with chiplet architectures and multi-chip interconnect standards such as UCIe or BoW.
  • Product management experience with AI/ML inference silicon, NPUs, GPUs, or inference accelerators.
  • Knowledge of CNN, transformer, LLM, and VLM inference workloads at the edge.
  • Experience with ODMs, OEMs, contract manufacturers, board design, system integration, or production.
  • Background in industrial, automotive, or embedded edge markets, plus an MBA or advanced engineering degree.

Culture & Benefits

  • Cross-functional collaboration with architecture, engineering, sales, marketing, executive, customer, and partner stakeholders.
  • Opportunities to present technical and product strategy at industry events and conferences.
  • Work on NPU hardware and software products spanning definition, customer sampling, ramp, sustaining, and end-of-life.

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