AI-Driven Physical Design Engineering (PhD Intern)

Location: On-site in the United States; primary location Santa Clara, California, with additional locations in Fort Collins, Colorado; Beaver Brook, Massachusetts; Hillsboro, Oregon; and Austin, Texas.

Annual salary: $141,998–$142,002 USD.

Company

hirify.global develops high-performance computing and silicon technologies for data-centric applications, including processing, storage, and networking solutions.

What you will do

• Research and implement AI and machine learning techniques to improve physical design processes and methodologies.
• Develop AI-enhanced workflows for high-performance silicon implementation, reducing manual effort and improving design quality.
• Build ML-powered data analysis and summarization pipelines for faster design decisions.
• Design Graph Neural Network-based systems for hirify.globalligent design-execution decisions.
• Develop automation frameworks using Python, TensorFlow or PyTorch, TCL, and Perl.
• Evaluate AI-driven methodologies against traditional approaches using Power, Performance, and Area metrics.

Requirements

• Enrollment in a PhD program in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
• Proficiency with physical design tools for synthesis, place and route, and timing analysis.
• Experience with Python or TCL for flow automation and debugging.
• Understanding of digital design, RTL design, and verification methodologies.
• Ability to collaborate with AI research and design engineering teams.

Nice to have

• Understanding of Graph Neural Networks or graph-based algorithms.
• Experience with Pandas, NumPy, and Matplotlib.
• Knowledge of reinforcement learning for design optimization.
• Strong Python programming and ML application experience.
• Background in EDA tools and physical design fundamentals.

Culture & Benefits

• On-site work model with full-time employment.
• Competitive pay with stock bonuses.
• Health, retirement, and vacation benefits.
• Collaborative work across AI research and design engineering teams.

Hiring process

• The application window is expected to end by February 9, 2027.
• Specific compensation details for the preferred location and role are shared during the hiring process.