Global Packaging Engineer – Lithography Business

Location: 100% onsite in Marlborough, Massachusetts; candidates within commuting distance are preferred.

Company

hirify.global develops materials and solutions for advanced electronics and high-tech industries.

What you will do

• Serve as the Global Packaging Engineering subject matter expert for manufacturing operations in Marlborough, Japan, Korea, and future global locations.
• Develop and maintain packaging standards, specifications, and best practices across manufacturing sites.
• Design, qualify, implement, and improve industrial packaging systems, including bottles, drums, IBCs, PE bags, corrugated packaging, pallets, and bulk packaging.
• Support new product introductions, manufacturing transfers, packaging changes, and capacity expansion projects.
• Ensure packaging systems meet product protection, chemical compatibility, transportation, safety, regulatory, and cost requirements.
• Lead supplier qualification, audits, root cause investigations, corrective actions, and continuous improvement initiatives in partnership with Quality, Procurement, Supply Chain, Logistics, Regulatory Affairs, and manufacturing teams.

Requirements

• Bachelor’s degree in Packaging Engineering, Chemical Engineering, Mechanical Engineering, Materials Engineering, or a related engineering discipline.
• 5+ years of packaging engineering experience in chemical, semiconductor, specialty materials, pharmaceutical, or similar manufacturing environments.
• Experience designing and implementing industrial packaging systems.
• Knowledge of chemical compatibility, hazardous materials packaging, and packaging validation.
• Experience leading cross-functional projects and working directly with suppliers.
• Strong analytical, problem-solving, and communication skills.

Nice to have

• Experience supporting global manufacturing organizations.
• Knowledge of UN, DOT, IATA, IMDG, and ADR transportation requirements.
• Experience developing engineering standards, technical specifications, and packaging best practices.
• Background in packaging sustainability and cost optimization.

Culture & Benefits

• Work with cross-functional teams supporting advanced electronics manufacturing.
• Comprehensive pay and benefits package.
• Equal opportunity employer with reasonable accommodation support for applicants.
• Artificial intelligence is used to enhance the recruitment process.