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14 дней назад

WATD Module Development Engineer (Semiconductor)

155 520 - 298 440$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
WATD Module Development Engineer (Semiconductor): Developing and optimizing advanced wafer assembly manufacturing processes, equipment, and process integration for next-generation semiconductor products with an accent on pathfinding, materials selection, metrology, and statistical process control. Focus on designing experiments, developing technology roadmaps, troubleshooting equipment, and collaborating with suppliers to enable high-volume manufacturing.

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $155,520–$298,440 USD

Company

hirify.global designs and manufactures semiconductor technologies, including advanced chip manufacturing and packaging solutions.

What you will do

  • Lead the design and development of advanced manufacturing processes and equipment for next-generation semiconductor products.
  • Conduct feasibility studies using simulations and practical engineering methods to meet device specifications.
  • Optimize process integration through material selection, equipment metrology, and parameter settings.
  • Develop pathfinding processes and hardware for innovative device architectures and create technology roadmaps.
  • Design and execute experiments using DOE and SPC to optimize process windows and control strategies.
  • Collaborate with equipment suppliers and materials vendors while improving equipment efficiency, reliability, and output.

Requirements

  • Bachelor’s degree in a relevant STEM field with 9+ years of relevant experience, or a master’s degree with 6+ years, or a PhD with 4+ years.
  • Experience with semiconductor processing, wafer-level assembly, cleanroom environments, process development, statistical process control, or manufacturing improvement.
  • Hands-on experience with module engineering, equipment troubleshooting, and preventive maintenance.
  • Strong technical communication, collaboration, problem-solving, attention to detail, and ownership.
  • This position is not eligible for hirify.global immigration sponsorship.

Nice to have

  • 10+ years leading process development programs from strategy through high-volume production.
  • Experience with pick-and-place, die attach, wire bonding, or flip-chip assembly.
  • Knowledge of SECS/GEM data streams, SEMI standards, and first-of-a-kind tools.
  • Statistical analysis experience with JMP, Minitab, or Python/pandas.

Culture & Benefits

  • Collaborative work with internal teams, equipment suppliers, materials vendors, and industry partners.
  • Health, retirement, and vacation benefits.
  • Competitive pay and stock bonuses.
  • Commitment to inclusive and ethical hiring practices.

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