Advanced Packaging Process Integration Engineer

Location: Hwasung, South Korea. The position requires access to controlled technology under United States Export Administration Regulations; candidates must be legally authorized to access the technology before starting.

Company

hirify.global develops semiconductor manufacturing technology and supports advanced packaging and 3D integration applications.

What you will do

• Build and maintain expertise in advanced packaging, 3D integration, 3D IC, and hybrid bonding technologies.
• Accelerate product readiness by addressing customer tool usability, automation, and operational challenges.
• Review system designs and requirements against customer product requirements.
• Define customer-driven technical requirements, performance targets, use cases, and product development priorities.
• Lead customer validation plans and support product strategy, business development, and roadmap planning.
• Share knowledge of advanced packaging and 3D integration processes across the organization.

Requirements

• More than 5 years of process or integration engineering experience in advanced packaging.
• Bachelor’s or Master’s degree in a technical subject, or equivalent experience and capability.
• Strong understanding of semiconductor manufacturing flows, advanced packaging, 3D integration, and interactions between process modules.
• Understanding of advanced packaging trends, customer roadmaps, and industry developments.
• Ability to translate customer technology challenges and application requirements into product priorities and business value.
• Strong English communication and presentation skills, with the ability to work with customers and cross-functional stakeholders.

Culture & Benefits

• Work with customers, peers, partners, and cross-functional stakeholders in an international semiconductor technology environment.
• hirify.global promotes an inclusive and diverse workforce and equal employment opportunity.