Principal Signal Integrity Engineer – R&D Networking Platforms
Контакты
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Singapore
signal integritypower integritypcb designserdescadencehspicekeysight adsansys hfssnetworking hardwareelectromagnetic analysis
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
Пожаловаться
Зарплата и рынок
ЗП не указана
На похожих ролях по рынку
$161к$205кмедиана$250к
50 в выборке
На СНГ рынке: $1.9к/мес ($1.8к - $2.5к)
84
Хорошая вакансия
развернуть
В HPE четко описана ведущая инженерная роль с заметным техническим влиянием и работой над сетевой и AI-инфраструктурой, но зарплата не указана, поэтому ее сложно сопоставить с рынком.
Кликните для подробной информации
Зарплата не указанаСовременные технологииЧеткая зона ответственностиAI-инфраструктура
Оценка от Hirify AI
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Подключить Plus
Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Principal Signal Integrity Engineer – R&D Networking Platforms (Signal and Power Integrity): Defining SI/PI strategy and leading architecture for next-generation networking platforms with an accent on high-speed SerDes, PCB design, simulation, and laboratory validation. Focus on resolving complex signal and power integrity challenges, improving modelling accuracy, and guiding technical decisions across multiple product families.
Location: Onsite in Singapore, Central Singapore, with an expectation of primarily working from an HPE office.
Company
hirify.global is a global edge-to-cloud technology company delivering open, standards-based networking solutions for branch, campus, core, and data center environments.
What you will do
Define SI/PI technical strategy, methodologies, design standards, engineering best practices, PCB stackup strategies, routing methodologies, and validation approaches across networking hardware platforms.
Lead signal and power integrity architecture for next-generation networking systems from concept through production, including high-speed SerDes interfaces.
Lead cross-functional technical reviews and resolve complex SI/PI issues across ASIC, package, PCB, mechanical, thermal, and system architecture disciplines.
Develop simulation, modelling, and automation methods; investigate field, validation, and manufacturing issues involving signal integrity, power integrity, timing, and electromagnetic interactions.
Evaluate emerging technologies and materials, drive technology readiness for future networking products, and contribute to patents, publications, and industry engagement.
Mentor engineers across multiple sites and serve as the final escalation point for critical SI/PI decisions involving performance, risk, schedule, and product cost.
Requirements
Bachelor's, Master's, or PhD degree in Electrical Engineering, Computer Engineering, or a related field.
15+ years of experience in signal integrity, power integrity, package design, PCB design, and high-speed system architecture.
Recognized expertise in high-speed digital system design, including electromagnetic theory, transmission line behavior, crosstalk, loss mechanisms, jitter, equalization, and channel optimization.
Extensive experience architecting and validating high-speed systems using advanced SerDes technologies and complex networking platforms.
Demonstrated success leading SI/PI strategies across multiple large-scale product developments from concept through production.
Expertise in time-domain, frequency-domain, statistical, BER, and electromagnetic SI/PI simulation methodologies.
Expert knowledge of Synopsys HSPICE, Keysight ADS, Ansys HFSS, SIwave, PowerSI, and Cadence design environments.
Extensive experience defining PCB stackups, design constraints, routing architectures, power distribution networks, and signal integrity requirements for high-volume products.
Hands-on experience with VNAs, TDRs, high-bandwidth oscilloscopes, spectrum analyzers, and compliance test equipment, including correlating simulations with laboratory measurements.
Strong understanding of system-level interactions between signal integrity, power integrity, thermal performance, electromagnetic compatibility, and manufacturability.
Nice to have
Technical leadership across geographically distributed engineering teams and the ability to influence architecture and engineering decisions without direct authority.
Experience mentoring engineers and developing technical capabilities within an organization.
Patents, publications, industry collaboration, or other significant technical contributions.
Excellent communication and presentation skills for explaining complex technical concepts to engineers, architects, executives, and customers.
Strong business and engineering judgment covering technical excellence, schedule, product cost, risk, and scalability.
Self-directed leadership and experience defining technical direction in highly ambiguous environments.
Culture & Benefits
Health, financial, and emotional wellbeing benefits for employees and their loved ones.
Personal and professional development programs supporting growth as a subject-matter expert or transition to another division.
Inclusive workplace that values varied backgrounds and individual uniqueness.
Flexibility to manage work and personal needs.
Opportunities to influence multiple networking platforms, future technology roadmaps, and AI infrastructure technologies.
Strong focus on innovation, technical excellence, continuous learning, patents, and industry-leading technical solutions.
Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →