Team Leader, Advanced Packaging (Quantum Computing)

Location: Hybrid role based in Espoo, Finland

Company

hirify.global builds full-stack quantum computers and develops quantum hardware and software systems for scientific and industrial applications.

What you will do

• Lead, coach, and develop engineers working on backend fabrication, advanced packaging, and process integration.
• Set technical priorities, allocate resources, and manage cleanroom capacity against QPU roadmaps and project needs.
• Drive technologies from research and proof of concept through robust, transferable, and manufacturable fabrication processes.
• Define development plans, milestones, success criteria, and process-readiness expectations.
• Guide hypothesis-driven experiments, evaluate data and technical conclusions, and manage iteration decisions and technical risks.
• Coordinate with Research, Process Engineering, Equipment, Measurement, System Engineering, Reliability, Quality, Production, and facilities teams to transfer mature processes into production.

Requirements

• Master’s degree in materials science, physics, electrical or chemical engineering, nanotechnology, microelectronics, or a related discipline.
• At least 5 years of experience in semiconductor manufacturing, microelectronics, advanced packaging, quantum technologies, or a comparable high-tech industry.
• At least 2–3 years of experience leading technical teams, projects, or multidisciplinary engineering activities, including coaching.
• Hands-on experience in backend process development and process integration, with a record of taking technologies to engineering or production readiness.
• Strong data-driven decision-making and structured problem-solving skills, including experimental methods, process capability analysis, and root cause analysis.
• Professional-level English is required. Strong stakeholder management and cross-functional communication skills are also expected.

Nice to have

• Cleanroom operations and safety leadership experience.
• Experience with flip-chip bonding, wafer-level packaging, through-silicon vias, or other fine-pitch integration technologies.
• Experience building a new team or function in a scaling organization.
• Familiarity with quantum computing, cryogenics, or other advanced hardware R&D.

Culture & Benefits

• Hybrid work setup and flexible hours.
• Learning Hub, LinkedIn Learning, and a team-based learning and development budget.
• Flat hierarchy with direct access to leadership.
• Opportunity to work in a growing organization positioned between a startup and a corporation.
• Opportunities to publish papers, participate in hackathons, and contribute to the broader quantum ecosystem.

Hiring process

• Interviews and hiring begin as soon as strong candidates are identified.
• Early application is encouraged.