Technology Development Process Engineer (Hybrid Bonding & Advanced Packaging)

Location: Singapore, Science Park II; moving to the Tampines office starting April 2027

Company

hirify.global develops materials science, engineering, and manufacturing solutions for semiconductor chips and advanced displays.

What you will do

• Develop and optimize end-to-end hybrid bonding processes, including surface preparation, wet and dry cleaning, plasma activation, dielectric-to-dielectric bonding, Cu-Cu direct bonding, and post-bond annealing.
• Lead process characterization and DOE studies to establish process windows and improve bond strength, void density, overlay accuracy, Cu oxidation control, and interface quality.
• Investigate process integration issues involving CMP topography, surface chemistry, contamination, pattern density, thermal budget, wafer or die warpage, and bonding defectivity.
• Collaborate with equipment, materials, metrology, and integration teams on scalable die-to-wafer hybrid bonding solutions for HBM, logic, and 3D heterogeneous integration.
• Define characterization methods using optical inspection, IR imaging, SEM, AFM, XPS, contact angle measurement, electrical testing, and reliability evaluation.
• Engage customers, research institutes, vendors, suppliers, and ecosystem partners while preparing technical reports, patents, publications, and technology roadmaps.

Requirements

• Bachelor’s, Master’s, or PhD in engineering, materials science, physics, or a related discipline.
• At least 5 years of semiconductor experience in technology development, process integration, or advanced packaging.
• Hands-on experience in one or more of advanced packaging, hybrid bonding, CMP, plasma processing, wet cleaning, TSV integration, or process integration.
• Understanding of hybrid bonding mechanisms and package integration flows.
• Experience with DOE, JMP or Minitab, and statistical process analysis.
• Knowledge of reliability, failure analysis, and advanced metrology techniques.

Nice to have

• Experience supporting HBM, logic, TSV, RDL, or die-to-wafer bonding technologies.

Culture & Benefits

• Supportive work culture focused on learning, professional development, and innovation.
• Collaboration with global R&D teams and experts in semiconductor and display technologies.
• Employee health and wellbeing programs and support for personal and professional growth.
• Regular full-time employment with no relocation eligibility.