Lead Application Engineer (IC Packaging Design & Analysis)

Location: Feldkirchen (Munich), Germany, or another hirify.global site in Europe

A valid work and residence permit is required.

Company

hirify.global provides software, intellectual property, hardware, and expertise for the complete electronics design chain, from chips and IC packaging to boards and systems.

What you will do

• Support customers deploying and adopting IC packaging design and analysis solutions.
• Debug and optimize system, board, package, heterogeneous 2.5D/3D-IC, and high-speed interface designs using hirify.global tools, scripting, and new methodologies.
• Lead methodology discussions, solution-oriented engagements, customer training, and technology adoption.
• Collaborate with R&D, field teams, and product specialists to reproduce issues, test solutions, and improve tool usability.
• Create technical documentation, examples, methodologies, and best-practice content for customer self-service and internal knowledge sharing.
• Collaborate with worldwide teams, mentor junior engineers, and contribute to technical expertise development.

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, or a related field.
• Experience designing IC packages with Allegro X Advanced Package Designer and knowledge of package technologies.
• Strong analytical, debugging, and problem-solving skills.
• Strong written, verbal, and presentation skills in English.
• Continuous learning mindset focused on IC package technologies and analysis.
• A valid work and residence permit is required.

Nice to have

• Signal Integrity and Power Integrity experience at IC package and PCB level.
• Experience with mentorship.

Culture & Benefits

• Full-time position within the Customer Success Team and System Design and Analysis organization.
• Opportunities for professional growth and leadership development.
• Collaboration with worldwide teams and cross-functional stakeholders.
• Work focused on advanced electronics design technologies used across consumer, cloud, automotive, aerospace, IoT, and industrial markets.