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11 дней назад

Technical Director, Advanced Packaging Integration

Формат работы
onsite
Тип работы
fulltime
Грейд
director
Английский
b2
Страна
Singapore
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
Technical Director, Advanced Packaging Integration (Semiconductor Packaging): Leading the development and integration of next-generation 2.xD and panel-level packaging technologies with an accent on materials selection, process flows, and cross-functional process optimization. Focus on designing complex engineering experiments, analyzing process and failure data, resolving yield and reliability issues, and directing technical collaboration with customers and suppliers.

Location: Singapore, Singapore

Company

hirify.global develops materials science and engineering solutions, equipment, and services for semiconductor and advanced display manufacturing.

What you will do

  • Lead cross-functional development of next-generation 2.xD packaging concepts, architectures, and technologies.
  • Define and implement end-to-end process flows for panel-level packaging and integrate lithography, etch, thin films, and related modules.
  • Lead material selection, characterization, compatibility assessments, and process co-optimization for large-format substrates.
  • Partner with customers and suppliers to define process specifications, acceptance criteria, technical direction, and technology-transfer plans.
  • Analyze process data, conduct defect root-cause analysis, and implement corrective actions to improve yield and reliability.
  • Design complex engineering experiments, publish technical findings, and mentor early-career engineers.

Requirements

  • Master’s degree with 10 years of experience or PhD with 5 years of experience in Electrical Engineering, Materials Science, Chemical Engineering, or a related field.
  • Hands-on expertise in advanced 2.xD packaging, including fan-out panel-level packaging, organic interposers, substrates, wafer-level back-end technologies, and related process flows.
  • Experience with semiconductor processing and integration, including lithography, dry etch, thin-film deposition, and materials modification at wafer or panel level.
  • Knowledge of process equipment, packaging materials, process characterization, metrology, materials and failure analysis, reliability, and qualification methodologies.
  • Proficiency in statistical data analysis, including DoE and JMP, with the ability to lead multifunctional teams through complex technical problems.
  • Strong technical communication skills, including executive presentations, reports, white papers, publications, and customer-facing discussions across geographies and time zones.

Culture & Benefits

  • Supportive work culture focused on learning, professional development, and career growth.
  • Health and wellbeing programs and employee support for work and personal life.
  • Regular employment with full-time status.
  • Relocation is not eligible for this role.

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