Senior Staff Professional - Procurement (Semiconductor)

Location: Singapore

Company

hirify.global develops semiconductor solutions for enterprise, cloud and AI, carrier, networking, optical interconnect, custom silicon, and accelerated infrastructure applications.

What you will do

• Develop and execute sourcing strategies for advanced packaging services, assembly and test operations, semiconductor test equipment, engineering development systems, and production test infrastructure.
• Lead supplier selection, commercial negotiations, contract management, and strategic supplier relationship management.
• Drive supplier performance improvements across cost, quality, delivery, responsiveness, and technology capability.
• Source advanced packaging technologies including 2.5D and 3D packaging, chiplet architectures, HBM-integrated designs, silicon interposers, advanced substrates, and heterogeneous integration platforms.
• Establish procurement strategies for ATE, burn-in, system-level test, probe and handler equipment, test interface hardware, and production qualification platforms.
• Align supplier roadmaps, capacity plans, and long-term agreements with AI and data center product growth and high-volume manufacturing requirements.

Requirements

• Bachelor’s degree in Engineering, Supply Chain, Business, Operations Management, or a related discipline.
• 8+ years of procurement, supply chain, sourcing, operations, or supplier management experience within the semiconductor industry.
• Experience negotiating complex commercial agreements and managing strategic supplier relationships.
• Strong understanding of semiconductor manufacturing and product development flows.
• Direct experience sourcing one or more of the following: advanced packaging services, OSAT services, semiconductor test equipment, semiconductor capital equipment, or manufacturing services.
• Familiarity with industry-leading suppliers in the OSAT, ATE, and laminate space.
• Experience supporting AI accelerators, networking ASICs, custom silicon, cloud infrastructure products, or high-performance computing platforms.
• Demonstrated analytical, financial, and problem-solving capabilities, with effective communication and stakeholder management skills.

Nice to have

• Knowledge of CoWoS, CoWoS-L, 2.5D/3D packaging, and chiplet integration.

Culture & Benefits

• Full-time employment in a collaborative, transparent, and inclusive environment.
• Eligibility to participate in bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
• Competitive compensation and benefits, with tools and resources for professional growth and development.
• Employment may require eligibility to access technology or software controlled under U.S. export laws; applicants may be subject to an export license review, except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3).
• AI tools, transcription apps, automated answer generators, and note-taking bots are prohibited during interviews; unauthorized use results in disqualification.