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2 дня назад

Software Engineer, AI Research Summer 2027 Intern (AI)

Формат работы
onsite
Тип работы
fulltime
Грейд
trainee
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Software Engineer, AI Research Summer 2027 Intern (AI): Developing AI/ML research solutions for semiconductor manufacturing equipment with an accent on algorithmic thinking, research, and productive software development. Focus on driving research tasks, translating ideas into Python or C/C++ code, and sharing technical insights across a multicultural team.

Location: San Jose, California, United States

Company

hirify.global's Silicon Valley AI lab researches and develops AI/ML technologies for semiconductor manufacturing equipment.

What you will do

  • Drive development of assigned AI research tasks.
  • Research and propose solutions to assigned research topics.
  • Convert ideas into code in existing and new codebases.
  • Contribute to knowledge sharing by presenting research topics and insights.
  • Apply Lean principles and continuous improvement thinking throughout project work.

Requirements

  • Proficiency in Python and/or C++ with the ability to read and modify existing codebases.
  • Strong algorithmic thinking and software development skills.
  • High familiarity with current AI approaches and research.
  • Clear written and verbal communication skills for technical deliverables.
  • Graduate-level study in a relevant field is preferred; rising junior or senior bachelor's students may also be considered.
  • Creative, collaborative, adaptable, and willing to learn complex application domains or new programming languages.

Culture & Benefits

  • Paid? No compensation details provided.
  • Meaningful, hands-on project work that contributes to business objectives.
  • Lean training and resources are provided.
  • Creative environment with open exchange of ideas across the lab and international colleagues.
  • Internship duration: May 17 through August 20, 2027.

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