Senior PCB Design Engineer

Location: Onsite in Penang, Malaysia

Company

hirify.global develops AI factory platforms, infrastructure software, advanced memory, compute systems, and end-to-end technology solutions for enterprise and high-performance computing workloads.

What you will do

• Design complex, high-density, high-speed multilayer PCBs, including HDI, rigid, and rigid-flex configurations.
• Optimize component placement and routing for signal integrity, power integrity, thermal performance, and EMI/EMC control.
• Collaborate with Hardware, Mechanical, SI/PI, Manufacturing, and Project teams to resolve design issues and implement layout changes.
• Work with PCB fabrication partners on stack-up optimization, Design for Manufacturing, and manufacturing yield.
• Prepare assembly and fabrication drawings, Gerber files, and complete PCB release documentation.
• Lead layout planning, design reviews, verification, engineering changes, and continuous improvement initiatives.

Requirements

• Master’s degree in Electrical and Electronics Engineering or Mechatronics.
• 5–8 years of experience in complex PCB design and layout.
• Strong understanding of high-speed PCB design, impedance control, stack-up planning, signal integrity, and power integrity.
• Knowledge of PCB fabrication and assembly processes, IPC standards, and DFM/DFA principles.
• Proficiency with Cadence Allegro, OrCAD, and Allegro X.
• Experience with PCB documentation, engineering change processes, product release, analytical problem-solving, and cross-functional teamwork.

Nice to have

• Experience with DDR4/DDR5, PCIe Gen4/Gen5/Gen6, SATA, USB, or similar high-speed interfaces.
• Experience designing high-speed PCBs for memory and storage products.

Culture & Benefits

• Collaborative environment focused on ownership, innovation, and servant leadership.
• Opportunities for continuous learning and exposure to advanced AI tools and technologies.
• Work in a fast-paced R&D environment with complex engineering challenges.