Internship - Understanding the Reliability of Advanced Laminate-Based Electronic Packages (Semiconductors)

Location: Nijmegen, Netherlands

Company

hirify.global develops semiconductor technologies, with this internship located within the Product Quality & Diagnostic Center.

What you will do

• Investigate the reliability boundaries of advanced laminate-based electronic packages.
• Study complex multi-material interfaces exposed to humidity with electrical bias and thermo-mechanical loading.
• Use failure analysis techniques to understand degradation and failure mechanisms.
• Assess the reliability of package systems in real-world automotive and industrial applications.
• Contribute to product qualification, reliability assessment, and the implementation of reliability test methods and evaluation strategies.

Requirements

• Master of Science internship in Microelectronics.
• Affinity with semiconductors, reliability, and physics.
• Ability to work as a team member in international and multidisciplinary teams.
• Flexibility and ability to multitask.
• Excellent written and verbal English communication skills.

Culture & Benefits

• Opportunity to develop technical, communication, and soft skills.
• Experience in a multinational and diverse environment.
• Practical assignments contributing to NXP's objectives.
• Collaboration across product quality, diagnostics, development, and qualification activities.