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SiGe HBT Device Modelling Intern (Summer 2027)

20 - 40$
Формат работы
onsite
Тип работы
fulltime
Грейд
trainee
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
SiGe HBT Device Modelling Intern (Summer 2027) (semiconductor device modeling): Developing compact models for advanced SiGe HBT devices using DC/RF characterization and the HiCUM L2 V3.0 industry-standard model with an accent on device physics, parameter extraction, and RF applications. Focus on comparing avalanche and non-quasistatic effects with measurement data, incorporating new physical effects into compact models, and presenting results to the technical team.

Location: Essex Junction, Vermont, USA; full-time internship requiring 20–40 hours per week.

Expected salary: $20.00–$40.00 per hour.

Company

hirify.global manufactures semiconductors for high-growth markets, including AI, with operations across the U.S., Europe, and Asia.

What you will do

  • Analyze measurement data for DC and RF device characteristics.
  • Develop a HiCUM L2 V3.0-based compact model for advanced SiGe HBT devices.
  • Extract compact-model parameters using advanced device-physics principles.
  • Develop procedures for incorporating new physical effects into compact models and propose new modeling methods where applicable.
  • Compare avalanche effects at high current densities and non-quasistatic phenomena with measurement data.
  • Present project results to the technical team and follow Environmental, Health, Safety & Security requirements.

Requirements

  • Be at least a second-year graduate student at the time of application and actively pursuing a Master’s or PhD in Electrical Engineering, Microelectronics, or a related field through an accredited degree program during the internship.
  • Have an overall GPA of at least 3.5 and be in good academic standing.
  • Have written and verbal fluency in English.
  • Be able to work 20–40 hours per week during the internship.

Nice to have

  • Related internship or co-op experience.
  • Leadership experience in the workplace, school projects, or competitions.
  • Project management skills, including innovation, execution, and navigating ambiguity.
  • Strong written and verbal communication skills.
  • Strong planning and organizational skills.
  • Knowledge of semiconductor device physics and characterization.
  • Familiarity with device compact models and the HiCUM high-current model.
  • Familiarity with Cadence Spectre, Keysight ADS, Cadence Virtuoso, or other design and simulation tools.
  • Data analysis and problem-solving skills.
  • Knowledge of shell scripting, MATLAB, R, and high-level programming languages such as Python, Perl, or Lisp.

Culture & Benefits

  • One-on-one mentorship and work assignments focused on professional growth.
  • Professional development opportunities and networking with executives.
  • Experience in the semiconductor industry through an entry-level internship program.
  • Commitment to workplace diversity, equal opportunity, and environmental, health, safety, and security practices.

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