обновлено 13 дней назад
Product Failure Analysis Engineer (Semiconductor)
149 100 - 215 925$
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Описание вакансии
Текст:
TL;DR
Product Failure Analysis Engineer (Semiconductor): Debugging and performing root-cause analysis of yield, reliability, and customer-return failures in FPGA products with an accent on non-destructive electrical fault isolation, circuit/layout analysis, and semiconductor failure analysis. Focus on using EMMI, Laser Voltage Probing, OBIRCH, design analysis tools, and DFT-based fault localization to drive yield and reliability improvements.
Location: San Jose, California, United States
Salary: $149,100–$215,925 USD per year for the Bay Area California region
Company
is a pure-play FPGA solutions provider developing programmable technologies for AI, cloud, networking, and edge markets.
What you will do
- Perform debug and root-cause analysis of yield, reliability, and customer-return failures in FPGA products.
- Drive electrical verification and fault isolation during product development, yield improvement, and reliability assessments.
- Define, execute, and interpret non-destructive fault-isolation methods using commercial testers and specialized tools.
- Use emission microscopy, Laser Voltage Probing, and OBIRCH for electrical fault isolation.
- Analyze layouts, schematics, and designs, and collaborate with physical failure analysis teams on defect modes.
Requirements
- Bachelor's degree in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, or a related field.
- 8+ years of experience in semiconductor failure analysis.
- 8+ years of experience with layout and design tools such as Virtuoso, Avalon, or SysNav.
- 8+ years of experience with Laser Voltage Probing, Photo Emission EMMI, and OBIRCH tools.
- 8+ years of experience with DFT, logic fault localization, and investigations focused on root cause and yield or reliability improvement.
- Applicants must be eligible for any required U.S. export authorizations.
Nice to have
- 10+ years of experience in semiconductor failure analysis.
- Understanding of FPGA architecture and design debug features.
- Experience with Teradyne Ultraflex testers.
- Experience with semiconductor packaging failure analysis.
Culture & Benefits
- Incentive opportunities based on individual and company performance.
- Collaboration across IC and package design, foundry, product, manufacturing, and reliability engineering teams.
- Work on programmable technologies for rapidly evolving AI, cloud, networking, and edge markets.
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