JEDI NCG 3D Heterogeneous Integration Engineer (Quantum Cryogenic 3D Packaging)

Location: Leuven, Belgium; 3-year local contract assignment at IMEC with a potential path to hirify.global USA in Malta, New York or Burlington, Vermont.

Company

hirify.global is a semiconductor manufacturer providing process technology, design, development, and manufacturing services for customers in growth markets.

What you will do

• Support research and development in cryogenic 3D packaging and system co-optimization within IMEC industrial affiliation programs.
• Learn and transfer advanced packaging integration flows, including TSV/TOVs, die-to-wafer and wafer-to-wafer bonding, and interposer technologies.
• Lead bilateral development projects between hirify.global and IMEC and coordinate technology transfer to the hirify.global Advanced Packaging Lab.
• Build relationships with semiconductor materials and tooling vendors while scouting new materials and integration schemes.
• Contribute to invention disclosures, scientific publications, conferences, technical updates, and executive readouts.
• Identify transferable program elements such as simulation models and design platforms.

Requirements

• Technology-related PhD preferred, or a degree in physics, electrical engineering, chemistry, computer engineering, materials science, chemical engineering, or a related discipline.
• Fluent written and verbal English required.
• Experience or knowledge in systems architecture, cryogenic and superconducting 3D packaging, heterogeneous integration, or advanced interconnects.
• Ability to work effectively with diverse teams, customers, and internal and external partners.
• Strong problem-solving, interpersonal, planning, organizational, and communication skills.
• Proficiency with Microsoft Office applications, including Excel, Word, PowerPoint, Outlook, and Teams.

Nice to have

• Systems partitioning and interconnect strategy expertise for heterogeneous integration, electrical die-to-die, and broadband surface coupling.
• Experience designing electrical test structures for interconnects and packages.
• Project management skills and the ability to navigate ambiguity.
• Postdoctoral research experience.

Culture & Benefits

• Collaboration with IMEC industrial affiliation programs and hirify.global R&D teams.
• Exposure to semiconductor corporations, universities, research institutes, materials suppliers, and tooling vendors.
• Opportunities to contribute to intellectual property, scientific publications, and conferences.
• Potential transition to hirify.global USA after the three-year IMEC assignment.