обновлено 14 дней назад
Product Manager - Advanced Packaging Polymer
Вакансия из Hirify Global, списка международных tech-компанийДля мэтча и отклика нужен Plus
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
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TL;DR
Product Manager - Advanced Packaging Polymer (Semiconductor Packaging): Leading the growth, profitability, and strategic direction of an advanced polymer portfolio for next-generation semiconductor packaging with an accent on product strategy, pricing, commercialization, and customer engagement. Focus on building product roadmaps, supporting customer qualifications, developing business cases, and coordinating cross-functional solutions across R&D, manufacturing, supply chain, and commercial teams.
Location: Marlborough, Massachusetts, United States
Company
develops materials and solutions for advanced electronics and high-tech industries.
What you will do
- Own portfolio revenue, profitability, market share, and growth performance.
- Develop pricing strategies, forecasts, annual operating plans, and product roadmaps.
- Manage product launches, lifecycle optimization, and product rationalization.
- Drive commercialization and support customer qualifications for new products.
- Partner with procurement, manufacturing, quality, finance, R&D, supply chain, and commercial teams.
- Engage customers, foundries, OSATs, and industry partners while leading cross-functional resolution of product, supply, quality, and customer challenges.
Requirements
- Bachelor’s degree in Chemical Engineering, Materials Science, Polymer Science, Chemistry, Semiconductor Engineering, or a related technical field.
- 2+ years of experience in semiconductors, advanced packaging, electronics, or specialty materials.
- 2+ years of product management, product line management, strategic marketing, business development, or commercial experience.
- Experience managing product portfolios, pricing, forecasting, and business performance.
- Strong commercial and financial acumen, with excellent analytical, communication, and presentation skills.
- Proven ability to lead and influence cross-functional teams.
Nice to have
- Master’s degree in Business, Engineering, Materials Science, or a related field.
- Experience with polyimide, PBO, advanced packaging materials, underfills, dielectric materials, or semiconductor adhesives.
- Knowledge of fan-out, 2.5D/3D packaging, chiplet architectures, or AI/HPC applications.
- Experience with product roadmaps, commercialization programs, product P&L, semiconductor foundries, OSATs, and substrate suppliers.
- Experience working within a global organization.
Culture & Benefits
- Full-time position within a global advanced electronics materials organization.
- Comprehensive pay and benefits package.
- Equal opportunity workplace with reasonable accommodation support.
- Visa sponsorship is not available now or in the future.
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