IC Package Thermal Mechanical Engineer

TL;DR

IC Package Thermal Mechanical Engineer (Thermo-mechanical simulation): Mechanical design and multiphysics simulation of advanced semiconductor IC packages for HPC, AI, and networking, with an accent on FEA/thermo-mechanical reliability modeling and physics-driven chip-package/package-board interaction. Focus on validating numerical models, automating simulation workflows (Ansys APDL, Python, MATLAB, DOE), and combining simulation with hands-on reliability lab testing (electromigration, temperature cycling, and drop tests).

Company

hirify.global develops semiconductor and infrastructure technology for high-performance computing and networking.

What you will do

• Develop, run, and validate advanced numerical FEA and multiphysics models to evaluate stress, strain, deformation, warpage, thermal cycling, and delamination.
• Apply structural mechanics, fluids, and heat transfer knowledge to solve complex chip-package and package-board interaction challenges.
• Automate simulation workflows by building reusable model-generation, post-processing, DOE, and reliability-data-analysis tools (Ansys APDL, Python, MATLAB), including ML/GenAI-driven interfaces.
• Perform and oversee hands-on reliability lab testing to investigate package failure mechanisms and use experimental data to define and predict product reliability.

Requirements

• Bachelor’s with 8+ years, or Master’s with 6+ years, or PhD with 3+ years in Mechanical Engineering, Material Sciences, or a related field focused on solid mechanics.
• Deep understanding of electronic packaging structures and advanced materials; ability to compare complex numerical simulations against first principles.
• Working knowledge of electromigration and silicon/IC packaging reliability.
• Hands-on expertise with major FEM tools, specifically ANSYS (Classic/Mechanical).
• Strong scripting/programming capability in Ansys APDL, MATLAB, and Python.

Culture & Benefits

• Annual base salary range: USD 109,700.00–175,500.00.
• Discretionary annual bonus and potential new hire equity grant and annual equity awards (subject to plan documents).
• Medical, dental, and vision plans; 401(k) with company matching; ESPP; EAP.
• Company-paid holidays, paid sick leave, and vacation time; paid family leave and other leaves per applicable laws.
• Equal opportunity employer.

Hiring process

• Apply through the candidate login flow (create an account if first time, otherwise sign in).
• Compensation and equity are subject to relevant plan documents and award agreements.

Location: USA-CA Irvine (Alton Parkway Bldg 2)

Salary: USD 109,700.00–175,500.00 annually