Sample Preparation Associate II (Chip Assembly & Wire Bonding)

TL;DR

Sample Preparation Associate II (Chip Assembly & Wire Bonding): Preparing chip samples for cryogenic testing by mounting chips and wire bonding to PCB stacks with an accent on precision micro-soldering and delicate connector assembly. Focus on executing repeatable production-style workflows under a microscope and optimizing throughput and yield for quantum computing hardware.

Location: Onsite in New Haven, CT

Salary: $63,000 - $86,000 USD per year

Company

D-Wave is a leader in the development and delivery of quantum computing systems, software, and services.

What you will do

• Mount chips to copper packages using approved adhesives, fixtures, and curing processes.
• Perform hand wire bonding of aluminum connections and operate manual/automated wire bonders.
• Micro-solder fine-pitch PCB connectors and jumpers with high precision.
• Handle and secure parts under a microscope using tweezers and micromanipulators.
• Clean samples using approved chemistries and ultrasonic baths.
• Inspect work via visual checks, continuity tests, and photo documentation.

Requirements

• 2+ years of practical experience in microelectronics, precision assembly, or hands-on lab work.
• Proven dexterity and patience for repetitive precision tasks under a microscope.
• Experience with micro-soldering and fine-pitch connectors.
• Proficiency in safe chemical handling, PPE use, and fume-hood operation.
• Strict adherence to ESD-safe practices and careful part handling.
• Must be based in or be able to work onsite in New Haven, CT.

Culture & Benefits

• Company ownership opportunities (equity).
• Competitive base pay and bonus structures.
• Collaborative environment focused on achieving ambitious goals in quantum computing.
• Inclusive culture that values diverse perspectives and professional growth.