Test Engineering Director (AI)
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
TL;DR
Test Engineering Director (AI): Leading the overall test engineering strategy for high-speed IO chiplet-based products with an accent on ATE platform selection, vendor engagement, and outsourced manufacturing test strategy. Focus on architecting scalable ATE IP, managing high-performing engineering teams, and driving continuous improvement in yield and production quality for advanced semiconductor applications.
Location: Must be based in Santa Clara, CA
Salary: $169,900–$254,500 per annum
Company
is a leading semiconductor company providing essential data infrastructure solutions across enterprise, cloud, and AI architectures.
What you will do
- Define and lead the overall test engineering strategy for high-speed and high-power AI applications.
- Drive strategic partnerships with Tier 1 ATE vendors, OSATs, and instrumentation providers.
- Lead cross-functional teams across silicon design, package engineering, and manufacturing to develop robust test infrastructure.
- Architect scalable ATE IP, software frameworks, and automation methodologies for multiple product families.
- Manage high-performing teams responsible for NPI, silicon characterization, and high-volume manufacturing deployment.
- Drive continuous improvement initiatives focused on test cost reduction, throughput optimization, and yield improvement.
Requirements
- Must be eligible to access export-controlled information under U.S. law.
- Bachelor’s, Master’s, or Ph.D. degree in Electrical Engineering, Computer Engineering, or related disciplines.
- 12+ years of experience in semiconductor test engineering, including 6+ years in a leadership role.
- Proven track record leading cross-functional organizations for NPI and high-volume manufacturing.
- Strong experience defining ATE architecture and reusable ATE IP platforms.
- Demonstrated leadership in CAPEX/OPEX planning, resource forecasting, and organizational scaling.
Nice to have
- Deep experience with high-speed IO and die-to-die interface characterization (PCIe, Serdes, UCIe, HBM, CXL).
- Hands-on experience with automated test platforms including Advantest 93K and Teradyne UltraFLEX.
- Strong software development skills in Python, C/C++, and Java.
- Experience with advanced packaging technologies like MCM, CPC, and CPO.
Culture & Benefits
- Comprehensive financial well-being programs including an employee stock purchase plan.
- Robust family support and mental health resources.
- Recognition and service awards to celebrate contributions.
- Commitment to professional growth and leadership development.
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