Failure Analysis And TEM Engineer (Semiconductor)
Мэтч & Сопровод
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Описание вакансии
TL;DR
Failure Analysis and TEM Engineer (Semiconductor): Developing and optimizing failure analysis workflows using Transmission Electron Microscopy to support technology development and yield improvement. Focus on operating state-of-the-art TEM equipment, interpreting complex results, and translating data for FAB process teams.
Location: On-site in Kiryat-Gat, Israel
Company
Foundry focuses on state-of-the-art semiconductor manufacturing, delivering cutting-edge silicon process and packaging technology for the AI era.
What you will do
- Define TEM workflow strategies and prepare plans for the sample preparation team.
- Operate TEM microscopes and other laboratory equipment hands-on.
- Interpret complex TEM results to provide actionable data for FAB process and integration teams.
- Develop and improve new workstreams and techniques for material characterization.
- Mentor TEM preparation technicians.
- Collaborate with multi-functional and multi-cultural teams to facilitate yield ramp-up.
Requirements
- Master's or PhD degree in science and engineering.
- At least 2 years of experience in a TEM engineering laboratory or semiconductor field (student experience included).
- Must be based in or able to work on-site in Kiryat-Gat, Israel.
- Availability to work weekends based on business needs.
- Strong analytical problem-solving and oral/written communication skills.
Nice to have
- PhD in a science and engineering major.
- 5+ years of experience operating Transmission Electron Microscopes.
- Expertise in various TEM sample preparation methods and strong interpretation skillsets.
- Understanding of FinFET technology architecture.
- Knowledge of wafer fabrication and general microelectronics.
Culture & Benefits
- Access to state-of-the-art laboratory workflows with a high level of autonomy.
- Work in a dynamic team supporting critical technology development and yield improvement.
- Opportunity to work within a worldwide factory network in a multi-cultural environment.
- Engagement with cutting-edge silicon process and packaging technology for the AI era.
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