Process Engineer (Semiconductors)

TL;DR

Process Engineer (Semiconductors): Owning and sustaining Die Attach processes to ensure stability and quality in high-volume manufacturing with an accent on parameter control, material management, and defect reduction. Focus on solving complex issues like die tilt and epoxy flow, optimizing yield, and implementing process change management across sites.

Location: Bangkok, Thailand

Company

A global leader in secure connectivity solutions for embedded applications across automotive, industrial, and IoT markets.

What you will do

• Own and sustain Die Attach processes, ensuring parameter control and material stability.
• Monitor performance, yield, and scrap to drive corrective actions and reduce deviations.
• Lead problem-solving for defects such as die tilt, epoxy flow, voids, and curing issues.
• Support NPI activities including DOE, machine capability studies, and qualification runs.
• Optimize processes for yield improvement, cost reduction, and equipment efficiency.
• Maintain engineering documentation including WI, OCAP, FMEA, and Control Plans.

Requirements

• Bachelor’s or Master’s degree in Electronics, Electrical, Mechanical, or Materials Engineering.
• 2+ years of experience in Die/Component Attach & Cure or related semiconductor assembly processes.
• Strong background in process sustaining and defect reduction in high-volume manufacturing.
• Experience with process change management, risk assessment, and controlled implementation.
• Excellent communication skills for collaborating with global teams and suppliers.
• Proficiency in Microsoft Office tools for analysis, reporting, and presentations.

Culture & Benefits

• Access to online and offline learning opportunities for core and professional skill development.
• Commitment to sustainability with measurable year-on-year progress.
• Inclusive work environment with a strong focus on diversity, equality, and zero tolerance for discrimination.