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5 часов назад

Field Application Engineer Intern (Software)

Формат работы
onsite
Тип работы
fulltime
Грейд
trainee
Английский
b2
Страна
China
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR

Field Application Engineer Intern (Software): Supporting customer firmware development and testing for PAM4 and Coherent DSP optical technologies with an accent on software/firmware support. Focus on debugging hardware/software systems, building lab automation scripts, and optimizing optical module performance.

Location: Must be based in or be able to work in Suzhou or Shanghai, China

Company

hirify.global is a semiconductor solutions provider creating essential building blocks for data infrastructure across enterprise, cloud, and AI architectures.

What you will do

  • Assist customers with module firmware and software development, including image flashing and register access.
  • Develop equipment control scripts for lab automation testing.
  • Tune and optimize customer modules for improved performance under engineering guidance.
  • Participate in product bring-up, initial software setup, and TX/RX performance testing.
  • Create and maintain technical documentation, FAQs, and internal training materials.
  • Support module control/management features and compliance checks (e.g., CMIS 5.x, 8636).

Requirements

  • Currently pursuing a Master’s degree in Software, Computer Science, Electronics, Electrical, or Control Engineering.
  • Proficiency in C and Python for writing utilities and modifying embedded code.
  • Able to commit for at least 4-6 months.
  • Strong communication skills and a collaborative mindset.
  • Eligibility to access export-controlled information under U.S. law.

Nice to have

  • Experience with DCA, BERT, or other test equipment.
  • Knowledge of signal and power integrity.
  • Experience with simulation tools such as ADS or HFSS.

Culture & Benefits

  • Hands-on experience with state-of-the-art PAM4 and Coherent ODSP technologies.
  • Mentorship and technical guidance from experienced FAEs and U.S. engineering teams.
  • Exposure to industry-leading SerDes DSPs in advanced process nodes (5nm/3nm/2nm).
  • Work environment characterized by collaboration, transparency, and inclusivity.

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