Foundry Customer Integration Engineer

TL;DR

Foundry Customer Integration Engineer (Semiconductor): Identifying recurring patterns from customer engagements, abstracting them into foundry standards, and systemizing/automating best practices across technologies and customers with an accent on FEOL/BEOL process integration and yield improvement. Focus on supporting customer projects, root cause analysis for yield/performance issues, and collaborating with technology development for seamless integration.

Location: US, Arizona, Phoenix (Hybrid work model - split time on-site and off-site)

Salary: $140,830 - $198,820

Company

hirify.global Foundry focuses on state-of-the-art semiconductor manufacturing, process technology, and customer enablement for AI-era products through global factory networks.

What you will do

• Identify patterns from customer engagements, abstract learnings into standards, and automate/proliferate them across technologies/customers.
• Serve as DRI for customer improvement projects, process issues, and communication between customer and factory as single point of contact for FEOL/BEOL integration.
• Collaborate with Technology Development to import new technologies to customer products.
• Work with integration, device, defect, and yield teams to root cause yield/performance issues and implement mitigation plans to meet targets.
• Own projects to improve product yield, quality, performance, and reduce wafer costs.

Requirements

• Bachelor's in Electrical Engineering, Materials Science, Physics, or related STEM; advanced degree preferred
• 10+ years in advanced node semiconductor FEOL/BEOL Process Integration
• 10+ years in advanced node semiconductor development or high-volume manufacturing
• Strong problem-solving, self-initiative, autonomy, and multi-cultural team collaboration
• High organization, pattern identification, communication, ownership, and interpersonal skills

Nice to have

• Advanced degree (Master's/PhD) in EE, Physics, or Materials Science
• 7+ years with module processes: lithography, dry/wet etch, CMP, thin films, metrology
• 7+ years in semiconductor process integration, device physics, logic/architecture, interconnect on leading nodes
• Strong project management; experience with 7nm-16nm FinFET, PDK, silicon modeling, test structures

Culture & Benefits

• Hybrid work model splitting on-site and off-site time
• Competitive pay, stock bonuses, health, retirement, and vacation benefits
• Shift 1 (United States of America)
• Focus on world-class service, yield improvements, and customer satisfaction in global manufacturing